Title:
HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2016/035789
Kind Code:
A1
Abstract:
[Problem] To provide a heat dissipation component for a semiconductor element, said component being endowed with high thermal conductivity and a coefficient of thermal expansion approximating that of the semiconductor element, and said component not experiencing swelling or cracking under conditions of actual use. [Solution] Provided is a heat dissipation component for a semiconductor element, said component characterized in being equipped with a composite part that contains 50-80 vol% of diamond powder, the particle diameter volumetric distribution thereof having a first peak at 5-25 μm and a second peak at 55-195 μm, the ratio of the area of the 1-35 μm particle diameter volumetric distribution and the 45-205 μm particle diameter volumetric distribution being 1:9 to 4:6, the balance of the composite part comprising an aluminum-containing metal, both principal surfaces of the composite part being provided with a surface layer containing at least 80% by volume of an aluminum-containing metal and measuring 0.03-0.2 mm in thickness, and at least one of the surface layers being further provided with (1) a crystalline Ni layer measuring 0.5-6.5 μm in thickness, and (2) an Au layer measuring 0.05 μm or more in thickness.
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Inventors:
ISHIHARA YOSUKE (JP)
MIYAKAWA TAKESHI (JP)
KOYANAGI KAZUNORI (JP)
MIYAKAWA TAKESHI (JP)
KOYANAGI KAZUNORI (JP)
Application Number:
PCT/JP2015/074843
Publication Date:
March 10, 2016
Filing Date:
September 01, 2015
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
C22C26/00; C22C47/12; C22C49/06; C22C49/14; C25D7/00; H01L23/373
Domestic Patent References:
| WO2013015158A1 | 2013-01-31 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
Sonoda and the Kobayashi patent business corporation (JP)
Sonoda and the Kobayashi patent business corporation (JP)
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