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Patent Searching and Data


Title:
HEAT DISSIPATION DEVICE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/135239
Kind Code:
A1
Abstract:
Provided in embodiments of the present invention are a heat dissipation device, a circuit board assembly, and an electronic apparatus. The heat dissipation device is applied to a circuit board provided with multiple heat-generating elements. The heat dissipation device comprises a substrate. At least one heat-conducting member is provided at one surface of the substrate facing the circuit board. One end of the heat-conducting member is connected to the substrate, and the other end thereof extends toward the circuit board and is in the vicinity of the heat-generating elements. Since at least one heat-conducting member is provided at the surface of the substrate facing the circuit board, and one end of the heat-conducting member is connected to the substrate and the other end thereof extends toward the circuit board and is in the vicinity of the heat-generating elements, heat generated by the respective heat-generating elements can be quickly transferred to the substrate by means of the heat-conducting member having low thermal resistance, and then the substrate dissipates the heat to the external environment, thereby effectively reducing thermal resistance for heat transfer from the heat-generating elements to the substrate, and improving heat dissipation efficiency of the heat dissipation device.

Inventors:
WEI LONGHE (CN)
CHEN JUN (CN)
LIAN ZHISHENG (CN)
LI QUANMING (CN)
Application Number:
PCT/CN2020/108348
Publication Date:
July 08, 2021
Filing Date:
August 11, 2020
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
JP2007329338A2007-12-20
US6275374B12001-08-14
JP2019102738A2019-06-24
CN101202529A2008-06-18
CN201911398409A2019-12-30
Other References:
See also references of EP 4081006A4
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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