Title:
HEAT DISSIPATION DEVICE FOR INDUSTRIAL COMPUTER
Document Type and Number:
WIPO Patent Application WO/2023/151716
Kind Code:
A2
Abstract:
The present utility model relates to the technical field of industrial equipment. Disclosed is a heat dissipation device for an industrial computer, the heat dissipation device comprising a base and a plurality of heat dissipation modules sequentially stacked upwards from the base, wherein each heat dissipation module comprises a support plate and a fan assembly arranged below the support plate, the support plate having several through holes, the bottom of the support plate being provided with support legs, and the top of the support plate being provided with positioning columns; the support legs between the two vertically adjacent heat dissipation modules fit with the positioning columns; and two fan assemblies are provided, and are symmetrically arranged. The heat dissipation device uses a modular configuration, is convenient to assemble, and occupies a small area.
Inventors:
KONG JUAN (CN)
Application Number:
PCT/CN2023/091920
Publication Date:
August 17, 2023
Filing Date:
April 29, 2023
Export Citation:
Assignee:
SUZHOU RUILINGKE INFORMATION TECH CO LTD (CN)
International Classes:
G06F1/20
Attorney, Agent or Firm:
SUZHOU ZHOUZHI PATENT AGENCY (SPECIAL GENERAL PARTNERSHIP) (CN)
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