HEAT-DISSIPATION DEVICE OF LED

Title:

HEAT-DISSIPATION DEVICE OF LED

Document Type and Number:

WIPO Patent Application WO/2016/000662

Kind Code:

A1

Abstract:

Disclosed is a heat-dissipation device of an LED. The device comprises one or a plurality of heat conducting material silks; a heat-dissipation housing of an LED chip is contacted with one end of the heat conducting material silks through heat conducting materials or in a direct manner, in order to transmit the heat to the heat conducting material silks and heat the surrounding air through the heat conducting material silks; the heat conducting material silks are arranged in an air flowing pipeline, and the heat is taken away by the flowing air; the pipeline is made of insulation materials. The weight and size of the heat-dissipation device of the LED can be reduced exponentially under the condition that a proper working temperature for the LED chip is ensured, and the ground insulation of the whole heat-dissipation device can be ensured.

Inventors:

ZHANG YIXING (CN)

Application Number:

PCT/CN2015/083294

Publication Date:

January 07, 2016

Filing Date:

July 03, 2015

Export Citation:

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Assignee:

ZHANG YIXING (CN)

International Classes:

H01L33/64; F21V29/00

Foreign References:

CN104124331A	2014-10-29
CN102252300A	2011-11-23
CN201277525Y	2009-07-22
CN101191611A	2008-06-04
CN101349519A	2009-01-21

Other References: