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Patent Searching and Data


Title:
HEAT DISSIPATION DEVICE AND SERVER
Document Type and Number:
WIPO Patent Application WO/2020/199759
Kind Code:
A1
Abstract:
Provided are a heat dissipation device (1) and a server. The heat dissipation device (1) comprises a heat dissipation assembly (2) and a bracket assembly (3). The heat dissipation assembly (2) is used for dissipating heat for a chip (5) of the server, and comprises: a substrate (201) and a radiator (202), with the heat dissipation assembly (2) being connected to a bracket assembly (3) via the substrate (201); and the bracket assembly (3), comprising a bracket (301) and multiple first elastic structural members (302) arranged on the bracket (301), with each of the first elastic structural members (302) comprising a supporting part (3021) and a connecting part (3022), and the connecting part (3022) being provided with at least one clamping hook (30221). When the heat dissipation assembly (2) and the bracket assembly (3) are mounted, the clamping hook (30221) is clamped to the heat dissipation assembly (2), such that the heat dissipation assembly (2) is fixed. In addition, the supporting parts (3021) generate upward buoyancy under the action of gravity of the heat dissipation assembly (2) to support the heat dissipation assembly (2), wherein same facilitates installation and removal and also prevents the chip (5) from being damaged in the installation, removal and dynamic load transportation scenarios.

Inventors:
JIAN YIYING (CN)
LI DINGFANG (CN)
GONG XINHU (CN)
XIA GAOLIANG (CN)
Application Number:
PCT/CN2020/075164
Publication Date:
October 08, 2020
Filing Date:
February 14, 2020
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G06F1/20; G06F1/18
Foreign References:
CN110045803A2019-07-23
CN101267723A2008-09-17
CN101267723A2008-09-17
CN108710409A2018-10-26
CN105280589A2016-01-27
CN201853688U2011-06-01
US20090135552A12009-05-28
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