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Title:
HEAT DISSIPATION DEVICE USING CONDENSED WATER FOR HEAT DISSIPATION
Document Type and Number:
WIPO Patent Application WO/2019/095327
Kind Code:
A1
Abstract:
A heat dissipation device using condensed water for heat dissipation comprises a solid-state refrigeration component (41). The solid-state refrigeration component (41) has a first surface (424) for forming condensed water provided at one side of a cool end thereof. The heat dissipation device further comprises a condensed water-guiding evaporation component (80) and a first radiator (30). The first radiator (30) has a second surface (316) for dissipating heat. One end of the condensed water-guiding evaporation component (80) is attached to the first surface (424) and another end thereof is attached to the second surface (316). The condensed water-guiding evaporation component (80) guides the condensed water formed on the first surface (424) onto the second surface (316). Under the effects of the second surface (316), the condensed water in the condensed water-guiding evaporation component (80) evaporates into the air and disperses the heat of the first radiator (30). The heat dissipation device guides the condensed water formed on the solid-state refrigeration component (41) to the radiator for heating and evaporation via the radiator. The invention appropriately utilizes condensed water to dissipate heat, thereby improving the efficiency of heat dissipation, and eliminating adverse effects of condensed water on the other electrical components of the heat dissipation device.

Inventors:
ZOU HAOXIONG (CN)
Application Number:
PCT/CN2017/111746
Publication Date:
May 23, 2019
Filing Date:
November 17, 2017
Export Citation:
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Assignee:
ZOU HAOXIONG (CN)
International Classes:
H05K7/20; F25B21/02; H01L23/36
Foreign References:
CN2909795Y2007-06-06
CN1298078A2001-06-06
CN102073361A2011-05-25
CN206411589U2017-08-15
CN202521816U2012-11-07
CN204963289U2016-01-13
DE4227148A11992-12-17
Attorney, Agent or Firm:
YONG HUI INTELLECTUAL PROPERTY (CN)
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