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Patent Searching and Data


Title:
HEAT DISSIPATION DEVICE USING HEAT PIPE PANEL
Document Type and Number:
WIPO Patent Application WO/2017/169080
Kind Code:
A1
Abstract:
Inner panels (3) that have at least one connected heat pipe (2) connected in the circumferential direction are included. Apparatuses (1) are installed outside the inner panels (3), which are obtained by connecting, in the circumferential direction, a plurality of heat pipe panels (6) that have the heat pipes (2) therein, so that the heat produced in the apparatuses (1) is diffused in the circumferential direction of the inner panels (3). Furthermore, web panels (8) that have horizontally arranged heat pipes (11) therein and that have heat-dissipating surfaces (9) are radially arranged at the corners of the inner panels (3), and outer panels (4) that oppose the inner panels (3) also have heat pipes (13) therein in a horizontal manner and have heat-dissipating surfaces (5) disposed thereon, thus thermally connecting the heat pipes (2, 11, 13).

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Inventors:
IZU HIROKI (JP)
OGURA YUICHI (JP)
NOMURA TAKEHIDE (JP)
HAYASHI KENGO (JP)
YAMASHITA SHINTARO (JP)
SAKATA SHIRO (JP)
KITAGAWA TETSUYA (JP)
Application Number:
PCT/JP2017/003642
Publication Date:
October 05, 2017
Filing Date:
February 01, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B64G1/50; F28D15/02
Foreign References:
JP2003137199A2003-05-14
US6206327B12001-03-27
JP2010208628A2010-09-24
JP2015513492A2015-05-14
JP2015522459A2015-08-06
Other References:
See also references of EP 3438004A4
Attorney, Agent or Firm:
MIZOI INTERNATIONAL PATENT FIRM (JP)
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