Title:
HEAT DISSIPATION DEVICES
Document Type and Number:
WIPO Patent Application WO/2018/184595
Kind Code:
A1
Abstract:
In an exemplary embodiment, a heat dissipation device is configured to dissipate heat from electronic components on a printed circuit board. The heat dissipation device generally includes a support mechanism comprising a main body and a connecting portion along an edge of the main body. The main body and the connecting portion form an internal space for accommodating the electronic components. The main body includes opposite first and second surfaces. The first surface faces the electronic component when the support mechanism is connected to the printed circuit board through the connecting portion. A first heat transfer member is disposed on the first surface. When the support mechanism is connected with the printed circuit board through the connecting portion, the first heat transfer member may be in contact with the one or more components and have a thickness of about 2 mils to about 15 mils.
Inventors:
ZHAO DANIEL (CN)
SHEN JINGBO (CN)
LIN XUEFENG (CN)
ZHOU JIE (CN)
SHEN JINGBO (CN)
LIN XUEFENG (CN)
ZHOU JIE (CN)
Application Number:
PCT/CN2018/082186
Publication Date:
October 11, 2018
Filing Date:
April 08, 2018
Export Citation:
Assignee:
TIANJIN LAIRD TECH LIMITED (CN)
International Classes:
H05K1/02; H05K7/20
Foreign References:
| CN107135598A | 2017-09-05 | |||
| CN203414502U | 2014-01-29 | |||
| US6373717B1 | 2002-04-16 | |||
| CN201854181U | 2011-06-01 | |||
| US20060109630A1 | 2006-05-25 | |||
| CN1767749A | 2006-05-03 |
Attorney, Agent or Firm:
BEIJING SANYOU INTELLECTUAL PROPERTY AGENCY LTD. (CN)
Download PDF: