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Title:
HEAT DISSIPATION ELEMENT AND PREPARATION METHOD THEREFOR, AND IGBT MODULE
Document Type and Number:
WIPO Patent Application WO/2019/019867
Kind Code:
A1
Abstract:
Disclosed are a heat dissipation element and a preparation method therefor, and an IGBT module. The heat dissipation element comprises a heat conductor and a heat dissipation body; the heat conductor is a ceramic aluminum-coated heat conductor; the heat dissipation body is an aluminum silicon carbon heat dissipation body; and the aluminum silicon carbon heat dissipation body is integratedly combined with at least one ceramic aluminum-coated heat conductor by means of aluminizing. Also disclosed are a preparation method for the heat dissipation element and an IGBT module comprising the heat dissipation element.

Inventors:
GONG QING (CN)
LIN XINPING (CN)
XU QIANG (CN)
LIU CHENGCHEN (CN)
Application Number:
PCT/CN2018/093956
Publication Date:
January 31, 2019
Filing Date:
July 02, 2018
Export Citation:
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Assignee:
BYD CO LTD (CN)
International Classes:
H01L23/367; H01L21/48; H01L23/373
Foreign References:
CN107611104A2018-01-19
CN107546200A2018-01-05
CN1929119A2007-03-14
US20120152510A12012-06-21
US20040130018A12004-07-08
Attorney, Agent or Firm:
TSINGYIHUA INTELLECTUAL PROPERTY LLC (CN)
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