Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT-DISSIPATION EXTRUDED ALUMINUM STRUCTURE AND CORRESPONDING BACKLIGHT MODULE
Document Type and Number:
WIPO Patent Application WO/2013/170509
Kind Code:
A1
Abstract:
Provided are a heat-dissipation extruded aluminum structure (22) and a corresponding backlight module. The structure (22) comprises a light source connecting part (221), a backboard connecting part (222), and a light guide plate supporting part (223). The structure and the corresponding backlight module have a low cost and a good heat dissipation effect, and can solve the problems of large volume and high cost of a conventional heat-dissipation extruded aluminum structure.

Inventors:
QUE CHENGWEN (CN)
CHEN SHIH HSIANG (CN)
WANG JIAQIANG (CN)
Application Number:
PCT/CN2012/076550
Publication Date:
November 21, 2013
Filing Date:
June 07, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
QUE CHENGWEN (CN)
CHEN SHIH HSIANG (CN)
WANG JIAQIANG (CN)
International Classes:
G02F1/13357; F21S8/00; F21V17/00; F21V29/00
Foreign References:
CN102135269A2011-07-27
TWM424510U2012-03-11
CN202074378U2011-12-14
CN202253402U2012-05-30
CN102494276A2012-06-13
CN102537882A2012-07-04
CN202394007U2012-08-22
CN202394013U2012-08-22
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
深圳翼盛智成知识产权事务所(普通合伙) (CN)
Download PDF: