Title:
HEAT DISSIPATION MATERIAL ADHERING COMPOSITION, HEAT DISSIPATION MATERIAL HAVING ADHESIVE, INLAY SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/002315
Kind Code:
A1
Abstract:
Provided are a heat dissipation material capable of ensuring stable adhesion while reducing cost, an inlay substrate using the same, and a method for manufacturing the same. According to the present invention, a heat dissipation material having an adhesive, in which the heat dissipation material is partially or totally coated, is obtained, by using a heat dissipation material adhering composition that contains an inorganic filler, a curing agent, and a resin component including an epoxy resin, and of which the complex viscosity at 80°C is 1×103-5×106Pa·s.
Inventors:
UMEDA HIROAKI (JP)
MATSUDA KAZUHIRO (JP)
YUKAWA KEN (JP)
MATSUDA KAZUHIRO (JP)
YUKAWA KEN (JP)
Application Number:
PCT/JP2016/002896
Publication Date:
January 05, 2017
Filing Date:
June 15, 2016
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J163/00; C09J5/06; C09J7/20; C09J7/30; C09J11/04; H01B13/00
Foreign References:
| JP2012207222A | 2012-10-25 | |||
| JP2006156610A | 2006-06-15 | |||
| JP2004179309A | 2004-06-24 | |||
| JP2006339559A | 2006-12-14 | |||
| JP2004319823A | 2004-11-11 | |||
| JP2004315688A | 2004-11-11 | |||
| JP2013006893A | 2013-01-10 | |||
| JP2007246861A | 2007-09-27 |
Other References:
See also references of EP 3315573A4
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
Download PDF: