HEAT DISSIPATION MATERIAL

WIPO Patent Application WO/2017/002489

A1

Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, -Si(CH3)3, -Si(CH3)2(OH), -Si(CH3)2(CH=CH) or -Si(CH3)2(CH2-CH=CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.

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UTA AKIRA (JP)
IKENO MASAYUKI (JP)
MATSUMOTO NOBUAKI (JP)
MASUDA KOHEI (JP)
SAKAMOTO TAKAFUMI (JP)

PCT/JP2016/065414

January 05, 2017

May 25, 2016

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SHINETSU CHEMICAL CO (JP)

C08G77/52; C08K3/00; C08L83/14; C09K5/00; H01L23/36; H01L23/373

WO2016024516A1

2016-02-18

JPS63230768A	1988-09-27
JP2012049567A	2012-03-08
JP2015160862A	2015-09-07
JP2014080522A	2014-05-08
JP2015078296A	2015-04-23

See also references of EP 3318593A4

PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)

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