Title:
HEAT DISSIPATION MEMBER AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074633
Kind Code:
A1
Abstract:
A heat dissipation member according to the present invention comprises: a copper-diamond composite body in which a plurality of diamond particles are dispersed in a metal matrix that contains copper; and a metal film which is bonded to at least one surface of the copper-diamond composite body. With respect to at least one cross-section of this heat dissipation member in the stacking direction, the bonding surface of the copper-diamond composite body and the metal film has at least one recess that is formed by falling-off of a diamond particle.
Inventors:
NAGASAWA MOTOI (JP)
NOGUCHI HYOJIN (JP)
NOGUCHI HYOJIN (JP)
Application Number:
PCT/JP2022/039554
Publication Date:
May 04, 2023
Filing Date:
October 24, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/373; B22F3/24; C22C1/05; C22C9/00; C22C26/00
Domestic Patent References:
| WO2007074720A1 | 2007-07-05 | |||
| WO2019159694A1 | 2019-08-22 |
Foreign References:
| JP2021168376A | 2021-10-21 | |||
| JP2015099913A | 2015-05-28 | |||
| JP2013098491A | 2013-05-20 | |||
| JP2005175006A | 2005-06-30 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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