HEAT DISSIPATION MEMBER AND METHOD FOR PRODUCING HEAT DISSIPATION MEMBER

Title:

HEAT DISSIPATION MEMBER AND METHOD FOR PRODUCING HEAT DISSIPATION MEMBER

Document Type and Number:

WIPO Patent Application WO/2016/035796

Kind Code:

A1

Abstract:

Provided are: a heat dissipation member that comprises a composite body part which is configured of a composite material, and to the surface of which a semiconductor element can be bonded with high bondability; and a method for producing this heat dissipation member. A heat dissipation member which is provided with: a composite body part that is configured of a composite material wherein particles of a good heat conductor are contained in a metal matrix; and a metal layer which is formed on at least one surface of the composite body part and is configured of a metal. A method for producing a heat dissipation member, which comprises: a preparation step for preparing a composite material wherein particles of a good heat conductor are contained in a metal matrix; a powder arranging step for arranging a metal powder that is composed of metal particles on at least one surface of the composite material; and a heating step for forming a metal layer that is configured of a metal of the metal powder on a composite body part that is configured of the composite material by heating the composite material and the metal powder in a state where the metal powder is arranged on the composite material.

Inventors:

MORIKAWA TATSUYA (JP)
KADOKURA TAKANORI (JP)
IWAYAMA ISAO (JP)

Application Number:

PCT/JP2015/074881

Publication Date:

March 10, 2016

Filing Date:

September 01, 2015

Export Citation:

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Assignee:

ALMT CORP (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)

International Classes:

H01L23/36; B22F3/14; C22C1/05; H01L23/373; H05K7/20

Foreign References:

JP2014001439A	2014-01-09
JPH10150124A	1998-06-02
JP2001284509A	2001-10-12

Other References: