Title:
HEAT DISSIPATION MODULE AND HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/159966
Kind Code:
A1
Abstract:
The present application discloses a heat dissipation module and a heat dissipation device. The heat dissipation module (100) comprises a heat dissipation fin bodies (110) and at least two loop channels (121) arranged on the heat dissipation fin bodies (110), at least one connection path (122) is arranged between the at least two loop channels (121), and the connection path (122) is used for communicating refrigerant working media in the two loop channels (121).
Inventors:
DUAN KAIWEN (CN)
NIE ZHIDONG (CN)
CHEN XIAOXUE (CN)
LIU XIN (CN)
CHU WENXIAO (CN)
TAN ZHOUTUO (CN)
LI SHUAI (CN)
NIE ZHIDONG (CN)
CHEN XIAOXUE (CN)
LIU XIN (CN)
CHU WENXIAO (CN)
TAN ZHOUTUO (CN)
LI SHUAI (CN)
Application Number:
PCT/CN2022/123884
Publication Date:
August 31, 2023
Filing Date:
October 08, 2022
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H05K7/20; F28D15/04
Domestic Patent References:
| WO2015198642A1 | 2015-12-30 |
Foreign References:
| CN113865393A | 2021-12-31 | |||
| CN111031754A | 2020-04-17 | |||
| CN204404869U | 2015-06-17 | |||
| CN110868838A | 2020-03-06 | |||
| CN104422319A | 2015-03-18 |
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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