Title:
HEAT DISSIPATION PLATE MATERIAL FOR HIGH OUTPUT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/047988
Kind Code:
A1
Abstract:
The present invention relates to a heat dissipation plate material having a low thermal expansion coefficient and high thermal conductivity, and thus able to be suitably used for a heat dissipation substrate for a high output semiconductor device using a GaN-type compound semiconductor. The heat dissipation plate material according to the present invention comprises a core layer and two cover layers formed and laminated on the top and bottom surfaces of the core layer. The core layer is made of a composite material in which a carbon phase is composited in a Cu matrix, and the cover layer is made of a Mo-Cu alloy.
Inventors:
KIM IL-HO (KR)
CHO MEOUNG-WHAN (KR)
KIM YOUNG-SUK (KR)
CHO MEOUNG-WHAN (KR)
KIM YOUNG-SUK (KR)
Application Number:
PCT/KR2016/009982
Publication Date:
March 15, 2018
Filing Date:
September 06, 2016
Export Citation:
Assignee:
THE GOODSYSTEM CORP (KR)
International Classes:
H01L23/373
Foreign References:
| KR20120095355A | 2012-08-28 | |||
| JP2006001232A | 2006-01-05 | |||
| KR20150133312A | 2015-11-30 | |||
| KR20070056088A | 2007-05-31 | |||
| KR20130143640A | 2013-12-31 |
Attorney, Agent or Firm:
IAM PATENT FIRM (KR)
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