Title:
HEAT DISSIPATION SHEET HAVING HIGH LOAD CARRYING CAPACITY AND HIGH THERMAL CONDUCTIVITY
Document Type and Number:
WIPO Patent Application WO/2018/061447
Kind Code:
A1
Abstract:
Provided is a heat dissipation sheet which achieves a good balance between high load carrying capacity and high thermal conductivity at a low cost. A heat dissipation sheet which has a configuration wherein silicone composition layers containing a thermally conductive filler are laminated on both surfaces of a reinforcing layer. This heat dissipation sheet is configured such that: the ten-point average roughness (RzJIS) of a surface of at least one of the silicone composition layers on the both surfaces of the reinforcing layer, said surface being not bonded to the reinforcing layer, is within the range of from 15 μm to 70 μm (inclusive); the durometer A hardness of the silicone composition layers is within the range of from 25 to 90 (inclusive); and the thermal conductivity of the heat dissipation sheet in the thickness direction is 2.5 W/(m∙K) or more.
Inventors:
WADA KOSUKE (JP)
YAMAGATA TOSHITAKA (JP)
KANEKO MASAHIDE (JP)
MITSUNAGA TOSHIKATSU (JP)
YAMAGATA TOSHITAKA (JP)
KANEKO MASAHIDE (JP)
MITSUNAGA TOSHIKATSU (JP)
Application Number:
PCT/JP2017/027311
Publication Date:
April 05, 2018
Filing Date:
July 27, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H05K7/20; B32B27/00
Foreign References:
| JP2000085024A | 2000-03-28 | |||
| JPH1160216A | 1999-03-02 | |||
| JPH08336878A | 1996-12-24 | |||
| JPH091738A | 1997-01-07 | |||
| JPH11307697A | 1999-11-05 | |||
| JPH07266356A | 1995-10-17 | |||
| JPH09199880A | 1997-07-31 |
Other References:
See also references of EP 3522689A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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