Title:
HEAT DISSIPATION SHEET AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2011/093182
Kind Code:
A1
Abstract:
Disclosed is a heat dissipation sheet, which has thermal characteristics capable of efficiently dissipating the heat generated by a heat generating device, and wherein residual chlorine is not present in a conductive polymer-impregnated sheet. Specifically disclosed is a heat dissipation sheet, which has a configuration wherein a metal layer (16) or (20) is closely bonded to both or one of the main surface (18a) and the back surface (18b) of a sulfur-containing π-conjugated conductive polymer-impregnated sheet (18) which is impregnated with a sulfur-containing π-conjugated conductive polymer that is obtained by polymerization using an iron (III) aromatic sulfonate serving as an oxidizing agent. The sulfur-containing π-conjugated conductive polymer-impregnated sheet is produced by immersing a sheet-like base into a solution that is obtained by diluting an iron (III) aromatic sulfonate with a first solvent and then immersing the resulting sheet-like base into a solution that is obtained by diluting a sulfur-containing π-conjugated conductive polymer-forming substance with a second solvent, thereby causing a polymerization reaction.
Inventors:
YOKOKURA TAKAHISA (JP)
MASUDA HIDEYUKI (JP)
MASUDA HIDEYUKI (JP)
Application Number:
PCT/JP2011/050837
Publication Date:
August 04, 2011
Filing Date:
January 19, 2011
Export Citation:
Assignee:
IREX INC (JP)
JUNSEI CHEMICAL (JP)
YOKOKURA TAKAHISA (JP)
MASUDA HIDEYUKI (JP)
JUNSEI CHEMICAL (JP)
YOKOKURA TAKAHISA (JP)
MASUDA HIDEYUKI (JP)
International Classes:
H01L23/36; B32B15/08; H01L23/373; H05K7/20
Foreign References:
| JP2010016272A | 2010-01-21 | |||
| JP2004095987A | 2004-03-25 | |||
| JP2007224182A | 2007-09-06 |
Attorney, Agent or Firm:
OKADA, Hiroyuki et al. (JP)
Hiroyuki Okada (JP)
Hiroyuki Okada (JP)
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Claims: