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Patent Searching and Data


Title:
HEAT DISSIPATION SHEET, METHOD FOR PRODUCING HEAT DISSIPATION SHEET, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/235919
Kind Code:
A1
Abstract:
Provided is a heat dissipation sheet that makes it possible to effectively enhance adhesiveness and long-term insulating reliability. This heat dissipation sheet comprises first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio greater than 2, and a binder resin. The content of the second inorganic particles is greater than the content of the first inorganic particles in 100 vol% of a 15% thickness region on a first surface side in the thickness direction, and the content of the first inorganic particles in 100 vol% of the 15% thickness region is greater than the content of the first inorganic particles in 100 vol% of a 70% thickness region in the center.

Inventors:
KAWAHARA YUKO (JP)
OOWASHI KEIGO (JP)
ASHIBA KOUJI (JP)
ZHANG RUI (JP)
INUI OSAMU (JP)
MAENAKA HIROSHI (JP)
Application Number:
PCT/JP2018/023690
Publication Date:
December 27, 2018
Filing Date:
June 21, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L23/373; B32B27/06; B32B27/18; C08K7/00; C08L101/12; H01L23/36; H05K3/38; H05K7/20
Foreign References:
JP6135817B12017-05-31
JP2017094541A2017-06-01
JP2013032496A2013-02-14
JPS6135817B21986-08-15
JP2012219251A2012-11-12
Other References:
See also references of EP 3644353A4
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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