Title:
HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2018/139364
Kind Code:
A1
Abstract:
The present invention provides a heat dissipation sheet which exhibits excellent adhesion to an object to be bonded such as a heating element, while having excellent handling properties. The present invention is a heat dissipation sheet 10 which is obtained by laminating a graphite sheet 12, a first heat conductive layer 13 and a second heat conductive layer 14 in this order, and which forms a heat dissipation member 11. The first heat conductive layer 13 is obtained by dispersing a heat conductive filler in a polymer matrix, and has a larger outer shape than the graphite sheet 12 when viewed in plan. The second heat conductive layer 14 is obtained by dispersing a heat conductive filler in a polymer matrix, and is more flexible than the first heat conductive layer 13, while having an outer shape that is not larger than the outer shape of the first heat conductive layer 13 when viewed in plan.
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Inventors:
KOYANO SHIGERU (JP)
IIMURO YOSHIFUMI (JP)
SAKAGUCHI YOSHIYA (JP)
IIMURO YOSHIFUMI (JP)
SAKAGUCHI YOSHIYA (JP)
Application Number:
PCT/JP2018/001604
Publication Date:
August 02, 2018
Filing Date:
January 19, 2018
Export Citation:
Assignee:
SEKISUI POLYMATECH CO LTD (JP)
PANASONIC IP MAN CO LTD (JP)
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L23/36; B32B18/00; H01L23/373; H05K7/20
Domestic Patent References:
| WO2016104074A1 | 2016-06-30 |
Foreign References:
| JP2004090516A | 2004-03-25 | |||
| JP2006093546A | 2006-04-06 | |||
| JP2016082155A | 2016-05-16 | |||
| JP3208275U | 2017-01-05 | |||
| JP2017014399A | 2017-01-19 | |||
| JP2014061662A | 2014-04-10 | |||
| JP2014187233A | 2014-10-02 | |||
| JP2016063201A | 2016-04-25 | |||
| JP2010070413A | 2010-04-02 | |||
| US20160209133A1 | 2016-07-21 |
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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