Title:
HEAT DISSIPATION STRUCTURE, BULK ACOUSTIC WAVE RESONATOR HAVING HEAT DISSIPATION STRUCTURE, FILTER, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/098488
Kind Code:
A1
Abstract:
A bulk acoustic wave resonator, comprising: a substrate (100); an acoustic mirror (101); a bottom electrode (102) provided above the substrate (100); a top electrode (104) provided opposite to the bottom electrode (102); a piezoelectric layer (103) provided above the bottom electrode (102) and between the bottom electrode (102) and the top electrode (104); and a heat dissipation structure, wherein an overlap area of the acoustic mirror (101), the bottom electrode (102), the piezoelectric layer (103), and the top electrode (104) in a thickness direction of the substrate (100) is an effective area (AR) of a resonator; the heat dissipation structure comprises a heat dissipation part and a heat lead-out part connected to the heat dissipation part; the heat lead-out part is located outside the effective area (AR), is in heat contact with an edge area of the effective area (AR), and is suitable for conducting heat from the effective area (AR) to the heat dissipation part. Furthermore, provided are a filter having the resonator, an electronic device having the filter, and a heat dissipation structure of a semiconductor device.
Inventors:
SUN CHEN (CN)
PANG WEI (CN)
ZHANG MENGLUN (CN)
YANG QINGRUI (CN)
PANG WEI (CN)
ZHANG MENGLUN (CN)
YANG QINGRUI (CN)
Application Number:
PCT/CN2019/114037
Publication Date:
May 22, 2020
Filing Date:
October 29, 2019
Export Citation:
Assignee:
UNIV TIANJIN (CN)
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
ROFS MICROSYSTEM TIANJIN CO LTD (CN)
International Classes:
H03H9/02
Foreign References:
| CN1497842A | 2004-05-19 | |||
| CN1497842A | 2004-05-19 | |||
| US20160308509A1 | 2016-10-20 | |||
| CN101483158A | 2009-07-15 | |||
| CN108604892A | 2018-09-28 | |||
| JP5018788B2 | 2012-09-05 |
Attorney, Agent or Firm:
BEIJING JINCHENG TONGDA & NEAL LAW FIRM (CN)
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