Title:
HEAT DISSIPATION STRUCTURE OF COIL PART, AND COIL PART USED THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/159010
Kind Code:
A1
Abstract:
A heat dissipation structure of a coil part (10) provided with a core (11) forming a magnetic circuit and having a plurality of legs, and a winding (12) wound on at least one leg to be wound selected from the legs and having a substantially flat section on an end face thereof, wherein at least one face of the core (11) and at least a part of the substantially flat section of the winding (12) are in contact with a radiator (S) via a thermally conductive material (T).
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Inventors:
NAGAOKA SHINGO (JP)
ZAITSU TOSHIYUKI (JP)
ZAITSU TOSHIYUKI (JP)
Application Number:
PCT/JP2017/000597
Publication Date:
September 21, 2017
Filing Date:
January 11, 2017
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
H01F37/00; H01F27/22; H01F27/24; H01F27/28; H01F30/10
Foreign References:
| JP2009027000A | 2009-02-05 | |||
| JP2015216209A | 2015-12-03 | |||
| JP2009176990A | 2009-08-06 | |||
| JP2013074144A | 2013-04-22 | |||
| JP2008072033A | 2008-03-27 | |||
| JP2008218699A | 2008-09-18 |
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
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