Title:
HEAT DISSIPATION STRUCTURE AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/214245
Kind Code:
A1
Abstract:
A heat dissipation structure and a display device. The heat dissipation structure comprises a back plate (11), a circuit board (12), and a heat conduction sheet (13); the circuit board (12) is provided with a first contact area (121) and a second contact area (122), and the second contact area (122) contacts the back plate (11); a first end of the heat conduction sheet (13) is attached onto a chip (220) of a display device flexible circuit board (22), and a second end is attached onto the first contact area (121) for use to conduct heat of the chip (220) to the circuit board (12) and the back plate (11).
Inventors:
CHENG JIAHE (CN)
Application Number:
PCT/CN2017/091884
Publication Date:
November 29, 2018
Filing Date:
July 05, 2017
Export Citation:
Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
H05K7/00; G02F1/13357; H05K7/20
Foreign References:
| CN1816261A | 2006-08-09 | |||
| CN205880423U | 2017-01-11 | |||
| CN204884440U | 2015-12-16 | |||
| CN106299098A | 2017-01-04 | |||
| CN102799003A | 2012-11-28 | |||
| CN104504998A | 2015-04-08 | |||
| US5808707A | 1998-09-15 |
Attorney, Agent or Firm:
SHENZHEN TALENT PATENT SERVICE (CN)
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