Title:
HEAT DISSIPATION STRUCTURE FOR DISPLAY PANEL, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/017151
Kind Code:
A1
Abstract:
A heat dissipation structure for a display panel, a preparation method therefor and application thereof. The heat dissipation structure comprises a copper foil layer (1) and a heat conductive layer (2) provided on the copper foil layer (1), wherein the material used for the heat conductive layer (2) comprises a heat conductive material (21) having a three-dimensional structure, and gaps in the three-dimensional structure of the heat conductive material (21) is filled with a buffer (22).
Inventors:
WANG YIJIA (CN)
Application Number:
PCT/CN2019/108979
Publication Date:
February 04, 2021
Filing Date:
September 29, 2019
Export Citation:
Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
H05K7/20
Domestic Patent References:
| WO2015053493A1 | 2015-04-16 |
Foreign References:
| CN109817829A | 2019-05-28 | |||
| CN103108531A | 2013-05-15 | |||
| CN208608200U | 2019-03-15 | |||
| CN204144262U | 2015-02-04 |
Attorney, Agent or Firm:
ESSEN PATENT & TRADEMARK AGENCY (CN)
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