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Patent Searching and Data


Title:
HEAT DISSIPATION STRUCTURE FOR ELECTRIC CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/025933
Kind Code:
A1
Abstract:
Provided is a heat dissipation structure for an electric circuit device, which exhibits excellent mass productivity and high heat dissipation performance. This heat dissipation structure for an electric circuit device comprises a heat dissipation plate exposed out of the electric circuit device, a heat transfer member, and a cooler that are disposed so as to form a stacked structure, wherein the heat transfer member is: made of a ceramic-resin compound material obtained by impregnating a resin composition in a sintered body in which ceramic primary particles are arranged in a three-dimensionally integrated structure; and arranged in a stacked manner so as to come into direct contact with at least one of the heat dissipation plate and the cooler.

Inventors:
YAMAGATA TOSHITAKA (JP)
INOUE SAORI (JP)
HIROTSURU HIDEKI (JP)
YOSHIMATU RYOH (JP)
KOGA RYUJI (JP)
Application Number:
JP2017/028133
Publication Date:
February 08, 2018
Filing Date:
August 02, 2017
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H01L23/36; H01L23/373
Domestic Patent References:
WO2014199650A12014-12-18
Foreign References:
JP2015096456A2015-05-21
JP2005150420A2005-06-09
Other References:
See also references of EP 3496139A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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