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Patent Searching and Data


Title:
HEAT DISSIPATION STRUCTURE FOR ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/059464
Kind Code:
A1
Abstract:
The present invention provides a housing of a user terminal, and a user terminal. The housing is provided with an insertion hole. The inner side of the housing is provided with a sealing member at the insertion hole. The sealing member is provided with an opening located at the middle of the insertion hole; when a pin passes through the sealing member through the insertion hole, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by providing a sealing member at an eject button aperture for removing a card tray of a user terminal, the eject button aperture can be sealed with small space occupation and low costs, so that a waterproof effect is achieved.

Inventors:
JIN LINFANG (CN)
YANG GUO (CN)
LIN SHUAINAN (CN)
Application Number:
PCT/CN2017/103830
Publication Date:
April 05, 2018
Filing Date:
September 27, 2017
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
CN206472427U2017-09-05
CN104601759A2015-05-06
CN105828551A2016-08-03
CN2598039Y2004-01-07
CN105472941A2016-04-06
CN203040086U2013-07-03
JP5028650B22012-09-19
CN201621093416U2016-09-28
Other References:
See also references of EP 3512318A4
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