Title:
HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/113543
Kind Code:
A1
Abstract:
According to various embodiments of the present disclosure, an electronic device may be provided, the electronic device comprising: a housing including a first housing and a second housing for guiding sliding movement of the first housing; a display having at least a portion that is configured to be unfolded on the basis of the sliding movement of the first housing, the display including a first display area disposed on the first housing and a second display area extending from the first display area; an electrical component disposed in the housing; a heat dissipation sheet configured to receive heat generated from the electrical component, the heat dissipation sheet including a bent area facing the first display area and a fixing area facing the second display area; and a slit structure formed in at least a portion of the bent area and having at least a portion extending along a first direction inclined with respect to the sliding direction of the first housing.
Inventors:
JUNG HYERAN (KR)
KANG SEUNGHOON (KR)
MOON HONGKI (KR)
PARK JONGKIL (KR)
LEE SEUNGJOO (KR)
KANG SEUNGHOON (KR)
MOON HONGKI (KR)
PARK JONGKIL (KR)
LEE SEUNGJOO (KR)
Application Number:
PCT/KR2022/020598
Publication Date:
June 22, 2023
Filing Date:
December 16, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H04M1/02; H05K7/20
Domestic Patent References:
| WO2021015310A1 | 2021-01-28 |
Foreign References:
| KR20180006533A | 2018-01-18 | |||
| US20210141419A1 | 2021-05-13 | |||
| KR20200076103A | 2020-06-29 | |||
| CN113329590A | 2021-08-31 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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