HEAT DISSIPATION STRUCTURE OF LIGHTING SOURCE FOR BACKLIGHT MODULE

WIPO Patent Application WO/2012/045219

A1

A heat dissipation structure of a lighting source for a backlight module comprises lighting source structures (21), a heat dissipation base (22) and a carrier plate (23). The lighting source structures (21) respectively have pins (212), and the heat dissipation base (22) has a supporting surface (221), a joint surface (222) and first through holes (223). The carrier plate (23) has second through holes (233) and joints to the joint surface (222) of the heat dissipation base (22). The lighting source structures (21) are provided on the supporting surface (221) of the heat dissipation base (22), and the pins (212) of the lighting source structures (21) pass through the first through holes (223) of the heat dissipation base (22) and the second through holes (233) of the carrier plate (23) and are electrically connected to the carrier plate (23). Therefore, the heat dissipation base (22) can directly support and thermally contact with the lighting source structures (21), so the heat dissipation efficiency of the lighting source structures (21) can be relatively improved.

JP2001283633	ILLUMINATION APPARATUS
JP2009008808	OPTICAL UNIT AND DISPLAY DEVICE
JP2014112470	LED LIGHTING DEVICE

QUE CHENGWEN (CN)

PCT/CN2010/079151

April 12, 2012

November 26, 2010

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SHENZHEN CHINA STAR OPTOELECT (CN)
QUE CHENGWEN (CN)

F21V29/00; G02F1/13357

WO2002012788A1

2002-02-14

CN201053658Y	2008-04-30
KR20100113418A	2010-10-21
CN101271209A	2008-09-24
CN1697207A	2005-11-16

ESSEN PATENT & TRADEMARK AGENCY (CN)
深圳翼盛智成知识产权事务所(普通合伙) (CN)

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