Title:
HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/019148
Kind Code:
A1
Abstract:
The present application provides a heat dissipation structure and a method for manufacturing the same. The heat dissipation structure comprises a magnetic conductive member and a bottom plate. The bottom plate is provided with a shaft tube thereon, and is provided with a through-hole arranged around the shaft tube. The through-hole accommodates the magnetic conductive member. A sticker is attached to a surface of the bottom plate facing away from the shaft tube. The sticker covers the through-hole, and the magnetic conductive member is attached and fixed to the sticker. In contrast to the prior art, when the bottom plate of the present application is manufactured, it is not required to integrate the magnetic conductive member into the bottom plate, thereby simplifying processes and improving efficiency. Moreover, a use of the sticker to fix the magnetic conductive member enables multiple functions of the sticker and reduces costs.
Inventors:
YU QIANG (CN)
Application Number:
PCT/CN2018/096779
Publication Date:
January 30, 2020
Filing Date:
July 24, 2018
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
H05K7/20
Foreign References:
| CN103762781A | 2014-04-30 | |||
| CN101532503A | 2009-09-16 | |||
| CN107196450A | 2017-09-22 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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