Title:
HEAT-DISSIPATION STRUCTURE, PROCESSING CIRCUIT PROVIDED WITH HEAT-DISSIPATION STRUCTURE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2012/120911
Kind Code:
A1
Abstract:
Provided is a heat-dissipation structure that has a reduced thickness of a heat-transfer sheet or can eliminate the heat-transfer sheet. The heat-dissipation structure (1A) has: a substrate (30); heat-releasing components (3, 4, 5) installed on the obverse of the substrate (30); a heat-dissipation plate (9) that is attached at the obverse side of the substrate (30) and that presses the top surface of the heat-releasing components (3, 4, 5); and a locking component (40). The heat-dissipation plate (9) has first slits (11a, 11b) of which one end extends to the vicinity of the locking component (40) and that partition between the center of a first pressing region that presses heat-releasing component (3) and the center of a second pressing region that presses the other heat-releasing components (4, 5).
Inventors:
TAKAHASI KAZUYUKI
Application Number:
PCT/JP2012/001673
Publication Date:
September 13, 2012
Filing Date:
March 09, 2012
Export Citation:
Assignee:
PANASONIC CORP (JP)
TAKAHASI KAZUYUKI
TAKAHASI KAZUYUKI
International Classes:
H01L23/40; H05K7/20
Foreign References:
| JP2009070999A | 2009-04-02 | |||
| JP2006054230A | 2006-02-23 | |||
| JP2006019403A | 2006-01-19 | |||
| JP2001358482A | 2001-12-26 | |||
| JP2004186294A | 2004-07-02 |
Attorney, Agent or Firm:
NII, Hiromori (JP)
New house Extensive 守 (JP)
New house Extensive 守 (JP)
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