Title:
HEAT DISSIPATION STRUCTURE FOR VEHICLE-MOUNTED ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/072294
Kind Code:
A1
Abstract:
Provided is a heat dissipation structure that conducts heat that is generated by a semiconductor from a heat spreader to a via hole for heat radiation in a printed circuit board via a joining member, and that does not obstruct a flow of heat that is conducted to the outside from a base via a heat conduction member. The problem addressed by the present invention is solved by: configuring a heat-conductive joining member that comprises solder or the like and that is in contact with a semiconductor heat spreader and a heat conduction member that is used to fill the gap between a printed circuit board land, a via hole for heat radiation, and a base so that the thermal capacity of each of the heat-conductive joining member and the heat conduction member tends to increase as proximity to the base increases; and by configuring the surface area of the rear-side land of the printed circuit board to be larger than the surface area of the front-side land.
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Inventors:
ABE HIROYUKI (JP)
SAITO MASATO (JP)
SAITO MASATO (JP)
Application Number:
PCT/JP2014/078011
Publication Date:
May 21, 2015
Filing Date:
October 22, 2014
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H05K7/20; B60R16/02; H01L23/12; H01L23/36; H05K1/02
Foreign References:
| JP2012018948A | 2012-01-26 | |||
| JP2010205863A | 2010-09-16 | |||
| JP2007115097A | 2007-05-10 | |||
| JP2007096009A | 2007-04-12 | |||
| JP2002026552A | 2002-01-25 | |||
| EP1796444A2 | 2007-06-13 |
Attorney, Agent or Firm:
INOUE Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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