HEAT DISSIPATION STRUCTURE

Title:

HEAT DISSIPATION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2013/187298

Kind Code:

A1

Abstract:

Provided is a heat dissipation structure which can be applied to electronic components having a high heat generation density without causing contact fault in the electronic components. Also provided is a simple method for repairing electronic devices. A heat dissipation structure characterized by being obtained by curing a thermally-conductive curable resin composition while same is filled within a electromagnetic shield case on a substrate on which an electronic component having a heat generation density between 0.2 W/cm2 and 500 W/cm2 is mounted. The thermally-conductive curable resin composition contains a curable liquid resin (I) and a thermally-conductive filler (II), and has a viscosity between 30 Pa∙s and 3000 Pa∙s at 23°C. Moreover, the thermal conductivity of the thermally-conductive curable resin composition, at which the thermally-conductive curable resin composition can be cured by means of humidity or heat, is 0.5 W/(m∙K) or higher.

Inventors:

OGUMA KEISUKE (JP)
KOUKAMI AKI (JP)
HAGIWARA KAZUO (JP)

Application Number:

PCT/JP2013/065646

Publication Date:

December 19, 2013

Filing Date:

June 06, 2013

Export Citation:

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Assignee:

KANEKA CORP (JP)

International Classes:

H01L23/36; H05K7/20

Foreign References:

JP2011187899A	2011-09-22
JPH0567893A	1993-03-19
JP2010171129A	2010-08-05
JP2011044448A	2011-03-03
JP2010171030A	2010-08-05
JPH0567893A	1993-03-19
JP2001251088A	2001-09-14
JP2003015839A	2003-01-17
JP2011236365A	2011-11-24
JP2010053331A	2010-03-11
JP2006096986A	2006-04-13
JP2003027025A	2003-01-29

Other References: