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Patent Searching and Data


Title:
HEAT DISSIPATION SUBRACK, HEAT DISSIPATION CABINET AND BACKBOARD COMMUNICATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/088771
Kind Code:
A1
Abstract:
Disclosed is a heat dissipation subrack, comprising a cabinet body (11) defining a containing space, wherein the cabinet body (11) is provided with an air inlet (12), two air supplementing openings (13) and an air outlet (14), the containing space (110) comprises an air inlet area (1101) and a heat source area (1102) being in communication with the air inlet area (1101), the opening direction of the air inlet (12) and the opening directions of the air supplementing openings (13) intersect in the air inlet area (1101), the cabinet body (11) comprises a plurality of baffles (15), each of the baffles (15) comprises two wind shielding faces, and airflow channels (151) are provided between every two adjacent baffles (15) and between the inner wall of the cabinet body (11) and the baffle (15) adjacent thereto.

Inventors:
WEI JUN (CN)
Application Number:
PCT/CN2020/125952
Publication Date:
May 14, 2021
Filing Date:
November 02, 2020
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
H04Q1/02
Domestic Patent References:
WO1987000261A11987-01-15
Foreign References:
CN107282583A2017-10-24
CN101790291A2010-07-28
CN109114856A2019-01-01
EP0752561A11997-01-08
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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