Title:
HEAT DISSIPATION SUBSTRATE FOR LED
Document Type and Number:
WIPO Patent Application WO/2011/129232
Kind Code:
A1
Abstract:
A heat dissipation substrate for an LED has copper foil or copper alloy foil layered on one side of a polyimide film and also has aluminum foil or aluminum alloy foil layered on the other side thereof. The thermal resistance between the surface of the copper foil or the copper alloy foil and the surface of the aluminum foil or the aluminum alloy foil is 1.8˚C/W or less.
Inventors:
YAMAGUCHI SHIGEYASU (JP)
NAKAYAMA OSAMU (JP)
NAGAO KEIGO (JP)
KOCHIYAMA TAKURO (JP)
MIZUTARE ATSUSHI (JP)
NAKAYAMA OSAMU (JP)
NAGAO KEIGO (JP)
KOCHIYAMA TAKURO (JP)
MIZUTARE ATSUSHI (JP)
Application Number:
PCT/JP2011/058649
Publication Date:
October 20, 2011
Filing Date:
April 05, 2011
Export Citation:
Assignee:
UBE INDUSTRIES (JP)
YAMAGUCHI SHIGEYASU (JP)
NAKAYAMA OSAMU (JP)
NAGAO KEIGO (JP)
KOCHIYAMA TAKURO (JP)
MIZUTARE ATSUSHI (JP)
YAMAGUCHI SHIGEYASU (JP)
NAKAYAMA OSAMU (JP)
NAGAO KEIGO (JP)
KOCHIYAMA TAKURO (JP)
MIZUTARE ATSUSHI (JP)
International Classes:
H01L33/64
Foreign References:
| JP2010021400A | 2010-01-28 | |||
| JP2007012288A | 2007-01-18 | |||
| JP2009266461A | 2009-11-12 | |||
| JP2005175150A | 2005-06-30 | |||
| JP2009172996A | 2009-08-06 | |||
| JP2006351666A | 2006-12-28 |
Attorney, Agent or Firm:
ITO, Katsuhiro et al. (JP)
Katsuhiro Ito (JP)
Katsuhiro Ito (JP)
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Claims: