Title:
HEAT DISSIPATION SUBSTRATE AND METHOD FOR MANUFACTURING SAID HEAT DISSIPATION SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/056637
Kind Code:
A1
Abstract:
A heat dissipation substrate having a metal layer with few defects on the surface is obtained by forming a metal layer by plating on the surface of an alloy composite chiefly comprising a main metal, an added metal, and diamond powder, and applying heat and pressure at or below the melting point of the metal layer and the alloy composite. This makes it possible to obtain a heat dissipation substrate in which Ni plating can be carried out at a soldering void rate of 5% or less, the heat dissipation substrate having a linear expansion coefficient of 6.5-15 ppm/K and a thermal conductivity of 420W/m/K or greater, and the defects on the surface of the metal layer being repaired.
Inventors:
FUKUI AKIRA (JP)
Application Number:
PCT/JP2015/078685
Publication Date:
April 14, 2016
Filing Date:
October 08, 2015
Export Citation:
Assignee:
SUPERUFO291 TEC (JP)
International Classes:
H01L23/373; B22F3/10; B22F3/14; C22C26/00; C23C18/16; C25D5/50
Domestic Patent References:
| WO2003040420A1 | 2003-05-15 | |||
| WO2007074720A1 | 2007-07-05 |
Foreign References:
| JP2014107468A | 2014-06-09 | |||
| JP2005175006A | 2005-06-30 | |||
| JP2002206170A | 2002-07-26 |
Other References:
See also references of EP 3206227A1
Attorney, Agent or Firm:
Kyoto International Patent Law Office (JP)
Patent business corporation Kyoto international patent firm (JP)
Patent business corporation Kyoto international patent firm (JP)
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