Title:
HEAT DISSIPATION SUBSTRATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/009208
Kind Code:
A1
Abstract:
This heat dissipation substrate (100) comprises a plurality of conductor pattern layers (4, 4A-4D); and an electronic component is mounted on this heat dissipation substrate. This heat dissipation substrate is provided with a plurality of core materials (10, 10A-10C) which contain a ceramic material; at least one of the plurality of core materials (10A-10C), namely a core material (10A) is provided with conductor pattern layers (4A, 4B) on a first surface (10Aa) and a second surface (10Ab); and this heat dissipation substrate is obtained by laminating the plurality of core material layers (10A-10C), with resin layers (2, 2A, 2B) being interposed therebetween.
Inventors:
NINOMIYA EMI (JP)
TAKAHASHI MAYUMI (JP)
TAKAHASHI MAYUMI (JP)
Application Number:
PCT/JP2018/024868
Publication Date:
January 10, 2019
Filing Date:
June 29, 2018
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H05K3/46; C04B35/16; H01L23/12; H01L23/13; H01L23/36; H05K1/03
Domestic Patent References:
| WO2014073604A1 | 2014-05-15 |
Foreign References:
| JPS55133597A | 1980-10-17 | |||
| JP2009231542A | 2009-10-08 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
Download PDF: