Title:
HEAT-DISSIPATION UNIT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/157807
Kind Code:
A1
Abstract:
The present application provides a heat-dissipation unit and an electronic device. The first radiator and second radiator comprised in the heat-dissipation unit are fastened on a printed circuit board (PCB) by means of a connecting unit; the connecting unit comprises a fixing pipe, a fixing post, and a first elastic element; the first radiator is fixed to the fixing pipe; the fixing post is sleeved in the fixing pipe, the upper surface of the fixing pipe abuts against the lower surface of the first projection of the fixing post, and the lower surface of the fixing pipe abuts against the upper surface of the PCB; the fixing post passes through the second radiator and the first radiator from top to bottom; the first elastic element is provided between the second radiator and the second projection of the fixing post, the first elastic element is sleeved at the outer side of the fixing post and is in a contracted state, and the second projection is located above the first projection. According to the technical solution of the embodiments of the present application, independent connecting units for fixing the first radiator and the second radiator can be combined together, the area of the PCB occupied can be reduced, and the area of heat-dissipation fins is increased.
Inventors:
GUO YE (CN)
SHI LEI (CN)
ZHANG ZHIPENG (CN)
ZHANG YONGLAN (CN)
CHEN YANG (CN)
FAN YI (CN)
SHI LEI (CN)
ZHANG ZHIPENG (CN)
ZHANG YONGLAN (CN)
CHEN YANG (CN)
FAN YI (CN)
Application Number:
PCT/CN2018/102900
Publication Date:
August 22, 2019
Filing Date:
August 29, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L23/367
Foreign References:
| CN106328612A | 2017-01-11 | |||
| CN1983575A | 2007-06-20 | |||
| CN201213344Y | 2009-03-25 | |||
| US20130313715A1 | 2013-11-28 |
Other References:
See also references of EP 3745454A4
Download PDF: