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Patent Searching and Data


Title:
HEAT EXCHANGER AND HEAT PUMP APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/262666
Kind Code:
A1
Abstract:
Provided are a heat exchanger and a heat pump apparatus with which uneven distribution of liquid refrigerant and gas refrigerant can be reduced in a header comprising multiple plate-shaped parts stacked on one another. This invention involves multiple flat pipes (28) and a liquid header (40) to which a liquid refrigerant pipe (20) and the flat pipes (28) are connected. The liquid header (40) has a fifth liquid-side member (45) having a fifth internal plate (45a) and a fourth liquid-side member (44) having a fourth internal plate (44a) stacked on the fifth internal plate (45a) on the side of the flat pipes (28). The fifth internal plate (45a) has a fifth liquid-side opening (45o) and the fourth internal plate (44a) has a fourth liquid-side opening (44o). When viewed in the stacking direction, the fifth liquid-side opening (45o) and the fourth liquid-side opening (44o) overlap each other in an overlapping region A and an overlapping region B provided in a different location to the overlapping region A. Refrigerant flows from the fourth internal plate (44a) toward the fifth internal plate (45a) in the overlapping region B, refrigerant flows from the overlapping region B to the overlapping region A in the fifth liquid-side opening (45o), and refrigerant flows from the fifth internal plate (45a) toward the fourth internal plate (44a) in the overlapping region A.

Inventors:
HIROKAWA, Tomoki
YAMADA, Kouju
Application Number:
JP2020/025377
Publication Date:
December 30, 2020
Filing Date:
June 26, 2020
Export Citation:
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Assignee:
DAIKIN INDUSTRIES, LTD. (JP)
International Classes:
F25B39/00; F28F9/02; F28F9/22
Attorney, Agent or Firm:
SHINJYU GLOBAL IP (JP)
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