Title:
HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2021/010421
Kind Code:
A1
Abstract:
A condensing section (10A) of a plate stack of this heat exchanger is formed in such a manner that a first refrigerant flow path (101) through which the gas-phase refrigerant flowing into a refrigerant inlet (110) flows and a first heat medium flow path (100) through which a heat medium flows overlap in the stacking direction of the plates. The condensing section (10A) dissipates heat from the gas-phase refrigerant to the heat medium, condenses the gas-phase refrigerant, and discharges the condensed refrigerant toward a gas-liquid separator (20). The gas-liquid separator separates the refrigerant condensed by the condensing section into a gas-phase refrigerant and a liquid-phase refrigerant, and discharges the liquid-phase refrigerant. A supercooling section is disposed on one side in the stacking direction with respect to the condensing section, and formed in such a manner that a second refrigerant flow path (101) through which the liquid-phase refrigerant discharged from the gas-liquid separator flows toward a refrigerant outlet (111) and a second heat medium flow path (100) through which the heat medium flows overlap in the stacking direction. The supercooling section dissipates heat from the liquid-phase refrigerant to the heat medium to supercool the liquid-phase refrigerant. The refrigerant inlet and the refrigerant outlet are each disposed on the opposite side of the supercooling section with respect to the condensing section or on the opposite side of the condensing section with respect to the supercooling section.
Inventors:
KAWAGUCHI SYOGO (JP)
TAMADA ISAO (JP)
MIZUNO YASUHIRO (JP)
TAMADA ISAO (JP)
MIZUNO YASUHIRO (JP)
Application Number:
PCT/JP2020/027526
Publication Date:
January 21, 2021
Filing Date:
July 15, 2020
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
F25B39/04; F28D9/02; F28F3/08
Domestic Patent References:
| WO2020022058A1 | 2020-01-30 |
Foreign References:
| FR3001796A1 | 2014-08-08 | |||
| US20160320141A1 | 2016-11-03 | |||
| JP2013506809A | 2013-02-28 | |||
| JP2017032250A | 2017-02-09 | |||
| JP2016519279A | 2016-06-30 | |||
| FR3059400A1 | 2018-06-01 | |||
| DE102011078136A1 | 2012-12-27 |
Attorney, Agent or Firm:
YOU-I PATENT FIRM (JP)
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