Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HEAT FLOW DISTRIBUTION MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/186330
Kind Code:
A1
Abstract:
 A heat flow distribution measurement device is provided with a sensor module (2) having: a single multilayer substrate in which a plurality of insulating layers (100, 110, 120) configured from a thermoplastic resin are layered, the multilayer substrate having one face (2a) and another face (2b) on the reverse side thereof from the one face (2a); and a plurality of heat flow sensor parts (10) formed in the multilayer substrate. The plurality of heat flow sensor parts (10) are each configured from a thermoelectric conversion element and are thermoelectrically independent. A computation part (3) computes a heat flow distribution on the basis of an electromotive force generated by each of the plurality of heat flow sensor parts (10). The plurality of thermoelectric conversion elements are formed in the single multilayer substrate, and are therefore manufactured in the same manufacturing step as the multilayer substrate. Differences in performance between individual thermoelectric conversion elements can therefore be minimized, and a heat flow distribution can be measured with high precision.

Inventors:
SHIRAISHI YOSHIHIKO (JP)
SAKAIDA ATUSI (JP)
GOUKO NORIO (JP)
TANIGUCHI TOSHIHISA (JP)
OKAMOTO KEIJI (JP)
Application Number:
PCT/JP2015/002742
Publication Date:
December 10, 2015
Filing Date:
June 01, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENSO CORP (JP)
International Classes:
G01K17/00; G01N25/18; H01L35/32; H01L35/34
Domestic Patent References:
WO2014196294A12014-12-11
Foreign References:
JP2014007376A2014-01-16
JP2009192431A2009-08-27
JPS5495282A1979-07-27
JP2004281666A2004-10-07
JP2014187124A2014-10-02
Other References:
See also references of EP 3153832A4
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
Download PDF: