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Title:
HEAT FLOW MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/204034
Kind Code:
A1
Abstract:
A heat flow measurement device 1 is provided with a heat flux sensor 10 and a thermocouple sheet 200. The heat flux sensor 10 comprises an insulating base material 100, a plurality of interlayer connection members 130, 140, a front surface wiring pattern 111, a back surface wiring pattern 121, a front surface protection member 110, and a back surface protection member 120. The thermocouple sheet 200 comprises a thermocouple 20, a first insulating sheet 210, and a second insulating sheet 220, and is fixed at position where the front surface protection member 110 and the back surface protection member 120 extend from the insulating base material 100 in the planar direction.

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Inventors:
GOUKO NORIO (JP)
TANIGUCHI TOSHIHISA (JP)
SAKAIDA ATUSI (JP)
OKAMOTO KEIJI (JP)
SHIRAISHI YOSHIHIKO (JP)
ASANO MASAHIRO (JP)
Application Number:
PCT/JP2017/018342
Publication Date:
November 30, 2017
Filing Date:
May 16, 2017
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
G01K17/08; G01K7/02; G01N25/18
Foreign References:
JPS54166887U1979-11-24
JPS5280192A1977-07-05
JPS57200828A1982-12-09
JPS6010138A1985-01-19
JP2016011950A2016-01-21
US6278051B12001-08-21
Attorney, Agent or Firm:
TOHDA, Kiyoshi (JP)
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