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Patent Searching and Data


Title:
HEAT-INSULATING DIE AND PRODUCTION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/008372
Kind Code:
A1
Abstract:
Provided is a die comprising a heat insulating layer which does not require a post-treatment, enables a higher level of uniformity in thickness, and has a superior adherence property to the die. Disclosed are a heat-insulating die and a production method thereof, wherein the die has a heat-insulating layer between a metal die base and a metal film configuring a molding surface, and the heat-insulating layer is made of a porous body in which ferrite crystal particles are connected in a three-dimensional mesh form.

Inventors:
TORII, Hideo (9-18, Nishikonoikecho 1-chome Higashiosaka-sh, Osaka 76, 〒5780976, JP)
鳥井 秀雄 (〒76 大阪府東大阪市西鴻池町1丁目9の18 Osaka, 〒5780976, JP)
KOJIMA, Shinya (5-1-2208, Wakamatsucho 5-chome Nagata-ku, Kobe-sh, Hyogo 38, 〒6530038, JP)
Application Number:
JP2011/065668
Publication Date:
January 19, 2012
Filing Date:
July 08, 2011
Export Citation:
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Assignee:
KOBE CERAMICS CORPORATION (6-2 Furuedai 1-chome, Suita-shi Osaka, 74, 〒5650874, JP)
神戸セラミックス株式会社 (〒74 大阪府吹田市古江台1丁目6の2 Osaka, 〒5650874, JP)
TORII, Hideo (9-18, Nishikonoikecho 1-chome Higashiosaka-sh, Osaka 76, 〒5780976, JP)
鳥井 秀雄 (〒76 大阪府東大阪市西鴻池町1丁目9の18 Osaka, 〒5780976, JP)
International Classes:
B29C33/38; B29L11/00
Attorney, Agent or Firm:
FUJII, Atsushi (Shinosaka-meikou-building 8F, 4-3-12 Miyahara, Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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Claims: