HEAT INSULATING FILM AND HEAT INSULATING COMPONENT

WIPO Patent Application WO/2023/002834

A1

Provided is a heat insulating film which, despite being provided with an inorganic compound layer, overcomes various problems that arise due to the occurrence of voids or microcracks in the inorganic compound layer. A heat insulating film (10) formed on at least a portion of the surface of a component 2 to be heat-insulated is formed from: an inorganic compound layer 20 in which scaly inorganic particles 22 are dispersed in an inorganic compound 21 formed from an alkoxide; and a top coat 30 that is formed on the inorganic compound layer 20, has a thickness of 0.5-30 µm, and is formed by an organic-inorganic hybrid material comprising a mixture of a metal alkoxide and a resin. By the formation of the top coat 30, voids 23 or microcracks in the inorganic compound layer 20 are filled by the organic/inorganic hybrid material, and the surface of the inorganic compound layer 20 is covered, whereby the heat insulating performance of the heat insulating film 10 is enhanced, and fuel efficiency of an engine is improved by forming the heat insulating film 10 on piston top surfaces of the engine.

JP2003071970	EASILY TEARABLE LAMINATED FILM AND EASILY TEARABLE
JP6495652	Heating element with a thin film
JP2007216678	TRANSPARENT GAS BARRIER FILM

YAMANOI RYOKO (JP)
YAMAKAWA NAOKI (JP)
TAGUCHI YOSUKE (JP)
MIYAMOTO KEISUKE (JP)

PCT/JP2022/026328

January 26, 2023

June 30, 2022

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ART METAL MFG CO LTD (JP)
AKROS CO LTD (JP)

B32B9/00; B32B7/027; C23C28/00; F02F3/10; F16J9/26

WO2016163244A1

2016-10-13

JPH04239078A	1992-08-26
JPH11255883A	1999-09-21
JPS5950084A	1984-03-22

OGURA & CO. (JP)

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