HEAT INSULATION PANEL SERVING ALSO AS MOLD FORM, AND OUTER HEAT INSULATION STRUCTURE

Title:

HEAT INSULATION PANEL SERVING ALSO AS MOLD FORM, AND OUTER HEAT INSULATION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2005/088022

Kind Code:

A1

Abstract:

A heat insulation panel (2) and a reinforcing panel (3) made of plastic material or the like are disposed in superposed relation on the outer side of a wall body (1) of RC construction. A mesh sheet (4) is installed as a base material on the outside of the reinforcing panel (3). And, tiles (5) serving as external cladding are bonded to the outside of the mesh sheet (4). The heat insulation panel (2) is formed of phenol foam or the like molded, e.g., in the form of a rectangular plate, while the reinforcing panel (3) is formed of acrylic plate, vinyl chloride plate or the like, and a number of groove-like air passage sections (3a) are continuously formed in a vertical direction on the inside of the reinforcing panel , i.e., on the side opposed to the heat insulation panel (2). The reinforcing panel (3) and heat insulation panel (2) are integrated in advance as by adhesive bonding. Such arrangement makes it possible to build an RC structure of heat-insulation construction which is superior in heat insulation, constructibility, and economical efficiency.

Inventors:

KANETSUNA KAZUO (JP)

Application Number:

PCT/JP2005/005061

Publication Date:

September 22, 2005

Filing Date:

March 15, 2005

Export Citation:

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Assignee:

SHINNIHON CORP (JP)
KANETSUNA KAZUO (JP)

International Classes:

E04B1/76; E04B1/80; E04B2/86; E04G9/10; (IPC1-7): E04B2/86; E04B1/76

Foreign References:

JPH066528U	1994-01-28
JPH066529U	1994-01-28
JPH066530U	1994-01-28
JPH08209825A	1996-08-13
JPH09150328A	1997-06-10
JP3485521B2	2004-01-13

Other References: