Field of Invention

The present invention relates generally to heat management systems for use or incorporation with computing systems.

Background

There is an increasing demand for computer system processors to be sped up, also known as over-clocking, resulting in increased consumed power of peripheral chipsets and the computer system and heat generated by components thereof, for example, by central processing unit (CPU) and the graphics processing unit (GPU). .

Heat generated by these heat generating components have to be dissipated and managed in order to prevent failure to the computing systems and to mitigate processing errors. The use of cooling fans is no longer sufficient to effectively manage heat generated by the computing systems.

There exist systems that use a closed-loop two-phase system, similar to those found in HVAC systems, which channels heated coolant in the vapour phase to a heat sink where heat is exchanged or dissipated before channelling of the coolant back in the liquid phase to a heat source. The heat dissipation rate of the closed-loop system is low and usually requires application with a secondary cooling system, for example a cooling fan.

Other existing systems utilises a configuration of a HVAC thermal loop combined with liquid submersion of computing system components, for example the CPU and the GPU. However, these systems requires complex routing of liquid to and from the HVAC thermal loop and proper isolation of portions of the computing system components that cannot be submersed in liquid, further resulting complex construction of a physical casing for accommodating the configuration.

Therefore, there is an apparent need for an improved heat management system for addressing the foregoing problems. Summary

In accordance with a first aspect of the invention, there is disclosed a heat management system comprising a housing and a gate structure. The housing defines an internal space and an opening to the internal space, the internal space being shaped for accommodating at least one heat generating component therewithin and the housing being adapted for containing liquid therein for substantially submerging the at least one heat generating device. The gate structure is couplable to the housing at the opening thereof for substantially impeding passage of liquid through the opening with the gate structure having a first face and a second face outwardly opposing the first face. The gate structure comprises a body and a plurality of electrical connectors formed in the body extending between the first face and the second face. The at least one heat generating component is electrically couplable to the gate structure at the first face thereof when being submerged in the liquid contained in the housing for electrical communication with at least one electrical device electrically coupled to the gate structure at the second face thereof so that heat generated by the heat generating component is communicated to the liquid contained in the housing.

In accordance with a second aspect of the invention, there is disclosed a heat management system comprising a housing, an encasement and a gate structure. The housing defines an internal space and an opening to the internal space with the internal space being shaped for accommodating at least one heat generating component therewithin. The housing is adapted for containing liquid therein for substantially submerging the at least one heat generating device. The encasement is adapted for accommodating at least a portion of the housing for defining a chamber between the housing and the encasement with the chamber for containing liquid. The gate structure is couplable to the housing at the opening thereof for substantially impeding passage of liquid through the opening with the gate structure having a first face and a second face outwardly opposing the first face. The gate structure comprises a body and a plurality of electrical connectors formed in the body extending between the first face and the second face. In the second aspect of the invention, the at least one heat generating component is electrically couplable to the gate structure at the first face thereof when being submerged in the liquid contained in the housing for electrical communication with at least one electrical device electrically coupled to the gate structure at the second face thereof so that heat generated by the heat generating component is communicated to the liquid contained in the housing with the housing further communicating heat from the liquid contained therein to the liquid contained in the chamber.

Brief Description of the Drawings

FIG. 1 shows a partial side elevation of a heat management system with a housing and a gate structure according to an embodiment of the invention;

FIG. 2 shows a partial front sectional elevation of the heat management system of FIG. 1 in accordance with view A-A thereof with a support structure of the gate structure being received within an internal space of the housing;

FIG. 3 shows a partial side elevation of the heat management system of FIG. 1 with the support structure of the gate structure being partially received within the internal space of the housing;

FIG. 4 shows a partial front sectional elevation of the heat management system of FIG. 1 with in accordance with view B-B of FIG. 3;

FIG. 5 shows a partial plan view of the body of the gate structure of the heat management system of FIG. 1 ;

FIG. 6 shows an exemplary arrangement of mechanical connectors formed on the body of the gate structure of FIG. 5 ; FIG. 7 shows a system configurative arrangement between heat generating components and at least one electrical device of a computing system with the gate structure of the heat management system of FIG. 1 ;

FIG. 8 shows a partial side elevation of an encasement for receiving the housing of FIG. 1 ; and

FIG. 9 shows a partial front sectional elevation of the encasement of FIG. 8 forming a chamber with the housing and in accordance to view C-C of FIG. 8.

Detailed Description

Reference will now be made in detail to an exemplary embodiment of the present invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the embodiment, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description of embodiments of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be recognized by one of ordinary skill in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail as not to unnecessarily obscure aspects of the embodiments of the present invention

For purposes of brevity and clarity, descriptions of embodiments of the present invention are limited hereinafter to heat management systems for managing heat generated by heat generating components of central processing units or computing systems and electronic devices. Examples of electronic devices to which the embodiments of the invention can be applied include, but are not limited to, desktop computers and other forms of personal computers including laptop computers; console gaming devices, handheld devices such as tablet computers, wearable computers and smart phones; servers including blade servers; disk arrays/storage systems; storage area networks; storage communication systems; work stations; routers; telecommunication infrastructure/switches; wired, optical and wireless communication devices; cell processor devices; printers; power supplies; displays; optical devices; instrumentation systems including hand-held systems; military electronics; etc. The concepts will be described and illustrated herein as applied to a desktop-sized computer. This however does not preclude embodiments of the invention where fundamental principals prevalent among the various embodiments of the invention such as operational, functional or performance characteristics are required. An exemplary embodiment of the invention, a heat management system 20, is described with reference to FIGS 1 to 9. The heat management system 20 is preferably used for managing heat generated by heat generating components 22 of a computing system 24, specifically high-performance computing systems.

Preferably, the heat management system 20 comprises a housing 26 defining an internal space 28 and an opening 30 to the internal space 28. The housing 26 is preferably made of metal, for example aluminium, or the like material having high heat conductivity. The housing preferably has a substantially rectilinear shape to facilitate access to the internal space 28. However, it is known to a person of ordinary skills in the art that the housing 26 may take on non-rectilinear shapes that enable accommodation of at least the heat generating components 22 therewithin. Additionally, the construction of the housing 26 is such that it is substantially leak-proof, except through intentionally formed openings or conduits through the housing 26, for containing liquid therein. The liquid can be any of coolant, oil, dielectric liquid, water or the like liquid that facilitates conveyance of heat from a heat source coming into contact therewith.

Preferably, the housing 26 is formed from sheet metal or molded from plastic. Alternatively, the housing comprises a cage formed from a plurality of struts and cladded with sheet metal or plastic panels (not shown).

The heat management system further comprises a gate structure 34 adapted for coupling to the housing 26 at the opening 30 thereof. The gate structure 34 comprises a body 36 defining a periphery 38 that substantially shape-matches the opening 30 of the housing 26 for forming a fit therewith. The body 36 of the gate structure 34 preferably substantially impedes passage of liquid through the opening 30 of the housing 26. Alternatively or in addition, the gate structure 34 comprises a seal 40 extending adjacent the periphery 38 of the body 36 for forming a liquid seal between the body 36 and the housing 26. The seal 40 is one or a combination of a polymeric seal, an elastomeric seal, a gasket and a mechanical seal. Preferably, the body 36 of the gate structure 34 defines a first face 42 and a second face 44 outwardly opposing the first face 44. The body 36 comprises a plurality of connectors 46 extending between the first face 42 and the second face 44. The plurality of connectors 46 are formed to substantially impede travel or wicking of liquids therealong. Preferably, the body 36 of the gate structure 34 is formed from a printed circuit board (PCB) with the plurality of connectors 46 being conductive pathways being formed thereon, for example, an electrical via. Alternatively, the body 36 of the gate structure 34 is formed from two stacked PCBs (not shown) with a plurality of connectors 46 comprising electrical pathways in the PCBs and the electrical inter-connector between the PCBs. Further alternatively, the body 36 of the gate structure 34 is moulded from plastic with the plurality of connectors 46 being formed as in-mold structures.

The gate structure 34 further comprises a support structure 48 coupled to the body 36. The support structure 48 is preferably planar and extends substantially perpendicularly from the first face 42 of the body 36. The support structure 48 is adapted for supporting the heat generating components 22 and for coupling the heat generating components 22 to the body 36 ₍ of the gate structure 38. Further, the support structure 48 is shaped and dimensioned for passage through the opening 30 of the housing 26 and for being accommodated within the internal space 28 of the housing 26 when the heat generating components 22 are coupled thereto and when the body 36 of the gate structure 34 couples to the housing 26 over the opening 30 thereof.

To facilitate disposing of the heat generating components 22 into the housing 26 and to further facilitate removal therefrom, the housing 26 comprises guide rails (not shown) formed within the internal space 28 of the housing 26 for guiding the support structure 48, and consequently the heat generating components 22, into and out from the internal space 28 of the housing 26. For facilitating use of the support structure 48 with the guide rails, the support structure 48 has to be adapted for being guided by the guide rails during travel through the opening 30 of the housing. The heat generating components 22 preferably comprises one or more of a mother board, a graphics processing unit, components thereof or the like circuit board assemblies and any combination of heat generating devices, for example solid state devices, that can still continue to operate when submerged in liquid. In addition to the heat generating components 22, the computing system 24 further comprises at least one electrical device 52 to be electrically coupled to the heat generating components 22 in order for the computing system 24 to operate. It is submitted that although the at least one electrical device 52 and the heat generating components 22 are constituents of the same computing system 24, the at least one electrical device 52 can comprise electrical devices that generate heat when in use but which are not submersible in liquid or where submersion in liquid is preferably avoided.

The at least one electrical device 52 comprises at least one of a power supply unit, one or more data storage devices, one or more data access ports or the like electrical devices or components which may be damaged when submerged in liquid. The gate structure 34 functions as an electrical interface between the heat generating components 22 and the at least electrical devices 50. By electrically coupling the at least one electrical device 52 to the second face 42 of the body 36 of the gate structure 34, the at least one electrical device 52 is able to electrically communicate with the heat generating components 22 through the plurality of connectors 46 formed in the body 36. The heat generating components 22 and the at least one electrical device 52 may be electrically coupled to the body 36 of the gate structure 34 by wire-bonding or soldered wirings. However, for convenience of removal and replacement of any of the heat generating components 22 and the at least electrical device 52, wirings extending from the heat generating components 22 and the at least electrical device 52 are coupled to mechanical connectors 54 disposed the first face 42 and the second face 44 and whereat ends of at least a portion of the plurality of connectors 46 terminate.

As shown in FIG. 7, the mechanical connectors 54 are arranged to substantially mitigate interference and cross-talk therebetween as well as between signal carrying cables extending therefrom. To achieve this, the configuration of the mechanical connectors 54 substantially avoids criss-crossing or overlapping of signal carrying cable especially when arranged with configurative positions of the heat generating components 22 and the at least one electrical device in mind. When setting up the heat management system 20 for use with the computing system 24, a motherboard constituting at least a portion of the heat generating components 22 is first disposed for coupling with the support structure 48. Wirings of the motherboard are then electrically coupled to the body 36 of the gate structure 34 at the first face 42 thereof. The computing system 24 may have additional processing boards, for example graphics processorss, constituting a portion of the heat generating components 22 for further coupling to the support structure 48 and the body 36 of the gate structure 38. Next, the internal space 28 of the housing 26 is substantially filled with liquid, for example with water, oil or dielectric liquid, before the support structure 48 carrying the heat generating components 22 is disposed thereinto for submergence in the liquid. In tandem, the body 36 of the gate structure 38 is positioned over the opening 30 of the housing 26 for coupling with the housing 26. A power supply unit, storage drives and hardware peripherals, for example keyboards, mouse and displays constituting the at least one electrical device 52 are coupled to the body 36 of the gate structure 38 for electrical communication with the heat generating components 22.

The housing 26 may be adapted for physically supporting or accommodating the at least one electrical device 52 away from the internal space 28 thereof. The power supply unit is then powered up for consequently powering up the computing system 24 for operations. When the computing system 24 is operating, heat is generated by the heat generating components 22. Since the heat generating components 22 are submerged, or at least substantially submerged, in the liquid, at least a portion of the generated heat is conducted away therefrom by the liquid to the housing 26. The housing 26 is preferably made of metal, aluminium or the like material with high heat transmissivity to enable heat received from the Uquid thereby to be dissipated into the ambient air surrounding the housing 26.

Further, the computing 24 comprises an on-board or an on-chip cooling apparatus (not shown) having, for example, one or more heat sinks, a fan and heat pipes. The on-board or on-chip cooling apparatus can be used in conjunction with the heat management system 20 to enable directed drawing heat from specific one or more of the heat generating components 22, for example from the microprocessor, for subsequent dissipation to the liquid . In addition, the heat management system 20 further comprises a housing liquid displacement apparatus (not shown) for churning the liquid in the housing 26. This mitigates building up of heat at specific locations within the internal space 28 which may prevent effective cooling or heat management of the heat generating components 22.

To facilitate dissipation of heat received by the housing 26, the heat management system 20 comprises a plurality of fin structures (not shown) formed thereon and preferably extending away from the internal space 28. The plurality of fin structures adds extensions to the surface area of the housing 26 to improve heat exchange with the surrounding atmosphere.

As an alternative or in addition to the plurality of fin structures, the heat management system 20 further comprises an encasement 58 adapted for accommodating at least a portion of the housing 26. When at least a portion of the housing 26 is received within the encasement 58, a chamber 60 is defined between the housing 26 and the encasement 58. The chamber 60 is for containing liquid for communicating heat between the housing 26 and the encasement 58 to facilitate dissipation of heat from the housing 26.

The heat management system 20 further comprises a chamber liquid displacement apparatus (not shown) for churning the liquid in the chamber 60. This mitigates building up of heat at specific locations within the chamber 60 which may prevent effective heat dissipation from the housing 26 which in turn may compromise effective cooling or heat management of the heat generating components 22.

When in use, the heat management system 20 can operate with one or both of the housing liquid displacement apparatus and the chamber liquid displacement apparatus. The housing liquid displacement apparatus and the chamber liquid displacement apparatus are couplable to a controller (not shown) to control operations thereof, for example, on-off states and speed of liquid displacement. Control of the housing liquid displacement apparatus and the chamber liquid displacement apparatus by the controller can be automatically effected based on temperature information gathered from on-board sensors of the heat generating components 22 and temperature sensors (all not shown) disposed in one or both of the internal space 28 and the chamber 60. Alternatively, control can be effected based on a pre- defined operating schedule for the housing liquid displacement apparatus and the chamber liquid displacement apparatus for managing the heat generated by the heat generating components 22.

To improve transfer of heat from the heat generating components 22 to the encasement 58 and when the heat management system 20 is implemented with the encasement 58, the housing 26 defines a plurality of apertures 66 for fluid communication the internal space 28 with the chamber 60 and to enable mixing of liquid in the internal space 28 with the liquid contained in the chamber 60.

At least one of the housing 26 and the encasement 58 is formable with a light permeable portion (not shown) to enable viewing of the chamber 60 and the internal space 28 therethrough. Light generating components (not shown), for example LED lighting, are disposable within one or both of the chamber 60 and the internal space 28 to enable emanating of light through the light permeable portion of the corresponding one or both of the housing 26 and the encasement 58 to improve the aesthetics of the housing 26 and encasement 58.

In a forgoing manner, a heat management system is described according to an exemplary embodiment of the invention. Although only one embodiment of the invention is disclosed in this document, it will be apparent to one skilled in the art in view of this disclosure that numerous changes and/or modifications can be made to the disclosed embodiment without departing from the scope and spirit of the invention.