Title:
HEAT MANAGEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/158153
Kind Code:
A1
Abstract:
This heat management system comprises a refrigeration cycle device (10) and a heat medium circuit (40). The heat medium circuit (40) has: a high temperature side circuit (41) to which the heat medium passage (12b) of a high temperature side water refrigerant heat exchanger (12) is connected; a low temperature side circuit (42) to which the heat medium passage (20b) of a low temperature side water refrigerant heat exchanger (20) is connected; and a heat transfer unit (43) that connects the high temperature side circuit (41) and low temperature side circuit (42). The low temperature side circuit (42) has a first heat exchange unit (51a), a second heat exchange unit (50a), a heat medium bypass passage (424), and a low temperature side circuit switching unit (422). When the heat transfer unit (43) is transferring heat, the low temperature side circuit switching unit (422) switches the circuit configuration of the low temperature side circuit (42) to a circuit configuration that circulates a heat medium between the first heat exchange unit (51a) and the heat medium bypass passage (424).
Inventors:
MAEDA TAKAHIRO (JP)
TERACHI SHOTA (JP)
MATSUI KENSHIRO (JP)
YOSHINORI TAKESHI (JP)
KASAMATSU SHINYA (JP)
TERACHI SHOTA (JP)
MATSUI KENSHIRO (JP)
YOSHINORI TAKESHI (JP)
KASAMATSU SHINYA (JP)
Application Number:
PCT/JP2021/045094
Publication Date:
July 28, 2022
Filing Date:
December 08, 2021
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
B60H1/22; F25B1/00; H01M10/613; H01M10/617; H01M10/625; H01M10/6556; H01M10/6569; H01M10/667
Foreign References:
| JP2019043262A | 2019-03-22 | |||
| JP2020178469A | 2020-10-29 | |||
| JP2020104670A | 2020-07-09 | |||
| JP2019055704A | 2019-04-11 | |||
| JP2015511480A | 2015-04-16 |
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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