Title: HEAT MANAGEMENT SYSTEM

Technical field of the invention

[0001] The invention relates to a heat management system, and to a method for producing a heat management device for forming the heat management system.

Background of the invention

[0002] Modern vehicles have heat management systems such as cooling/heating circuits, inter alia in order to make comfort functions available to the occupants and to ensure the necessary temperature control of components such as drive components. Cooling/heating circuits consist essentially of heat management components such as pumps, valves and heat exchangers and of components which serve to carry a fluid and which fluidically connect the heat management components to one another. The fluid is moved back and forth between the heat management components by means of the fluid-carrying components in a circuit and serves for the exchange of heat between the heat management components.

[0003] In order to meet the requirement for reduced installation space in modern vehicles, heat management systems are increasingly being designed to be more compact. In addition to reducing the size of the heat management components, the compact design of the fluidcarrying components and the arrangement of the heat management components relative to one another and relative to the fluid-carrying components play a decisive role. The embodiment of all fluid-carrying components of a cooling/heating circuit as an integral fluidcarrying component, hereinafter also referred to as a heat management device, enables a particularly space-saving configuration of cooling/heating circuits. In this case, the heat management components are fitted to the integral fluid-carrying component.

[0004] By virtue of the skilful configuration of the integral fluid-carrying components and an advantageous arrangement of the heat management components, it is possible to achieve a reduction in the installation space required for the heat management system. Often, the dimensions of the heat management components cannot be arbitrarily reduced since minimum dimensions are required to ensure their functioning. Thus, a heat exchanger requires a certain minimum area / a certain minimum volume in order to be able to achieve a required transfer of thermal energy.

[0005] The limiting factor in the reduction of installation space of heat management systems is therefore often the size of the heat management components and their arrangement on the integral fluid-carrying components. Accordingly, the integral fluidcarrying components could be made even more compact, but then there would no longer be enough space for the arrangement of the heat management components on the integral fluidcarrying component. In order to reduce the installation space, the heat management components must therefore be arranged relative to one another and fitted to the integral fluidcarrying component in a manner which is as space-saving as possible.

[0006] The prior art discloses solutions for the arrangement of heat management components on integral fluid-carrying components. The proposed solutions are based on the arrangement of the heat management components on one side of the integral fluid-carrying components. However, the prior art does not disclose a solution for arranging the heat management components on integral fluid-carrying components from several sides in a manner which is optimal in terms of installation space.

Summary of the invention

[0007] The invention is based on the technical problem of making available a heat management system for the arrangement and fitting of heat management components on integral fluid-carrying components in a manner which is optimized in terms of installation space.

[0008] The present document describes a heat management system for a vehicle, in particular an electric or hybrid vehicle. The heat management system contains a heat management device comprising a base element having a first side and a second side and at least one hollow volume. The base element and the hollow volume extend in one plane.

[0009] The heat management system further contains a first heat management component from a first group comprising a valve, a pump, a compressor or a heat exchanger, and an additional heat management component from a second group comprising a temperature sensor, a flow sensor or a pressure sensor. [0010] The first heat management component is arranged at a first location on one of the first side and the second side, and the additional heat management component is arranged at an additional location on the other of the first side and the second side. The hollow volume extends between the first location and the additional location in order to allow the heat management component and the additional heat management component to interact with, in particular penetrate, the hollow volume.

[0011] At least a part of the first heat management component or a further heat management component is situated in a direction perpendicular to the plane, or in the immediate vicinity thereof, with respect to the additional heat management component.

[0012] The area of the heat management device on which heat management components can be arranged and fitted is maximized by arranging the first heat management component and the additional heat management component on both sides. This results in more freedom for the configuration of the heat management device and the arrangement of the heat management components on the heat management device. Thus, a space- saving arrangement of the heat management components on the heat management device can be achieved, thereby making it possible to embody the unit consisting of the heat management device and the fitted heat management components in a more space-saving manner.

[0013] For given dimensions of the heat management device, the arrangement and fitting of the heat management components on both sides makes it possible for the first time to arrange and fit all the required heat management components on the heat management device. In this case, the available installation space would not be sufficient for arrangement of the heat management components on one side.

[0014] On the one hand, the accessibility of the heat management device on both sides makes it easier to assemble the heat management system and fit the heat management components. On the other hand, the replacement of heat management components during the use phase of the vehicle can also be made easier, e.g. in the event of a defect of a heat management component.

[0015] In addition, by virtue of the two-sided, opposite arrangement of the first heat management component and the additional heat management component, the hollow volume, which extends from the first heat management component to the additional heat management component, can be embodied with a smaller extent. Often, the first heat management component and the additional heat management component cannot be arranged arbitrarily close to one another owing to their respective spatial extent. Arranging the first heat management component and the additional heat management component opposite one another enables the first location and the additional location to be placed closer to one another since the first heat management component and the additional heat management component do not have to share the same installation space. The shorter extent of the hollow volume makes it possible, for example, to reduce the flow and heat losses and thus to increase the energy efficiency of the heat management system.

[0016] The additional heat management component is preferably used to operate the first heat management component.

[0017] If the additional heat management component, such as, for example, a temperature sensor, is used to operate the first heat management component, then, for example, the temperature measured by the additional heat management component can be used as an input variable for the open-loop or closed-loop control of the first management component, for example a heat exchanger. In this case, it is desirable to detect the temperature as close as possible to the first heat management component in order to reduce cooling or heating effects with increasing distance from the first heat management component. Arranging the first heat management component and the additional heat management component on both sides and opposite one another enables the first heat management component and the additional heat management component to be arranged closer to one another. Thus, undesirable influences on the temperature measured by the additional heat management component can be reduced.

[0018] The base element is preferably plate-shaped and, as a further preference, the hollow volume is at least one integrated fluid path which extends in the plane.

[0019] The plate- shaped configuration of the base element makes it easier to arrange the heat management components to be fitted to the heat management device in a manner that is optimal in terms of installation space. In the case of plate-shaped base elements, cuboidal volumes are obtained on both sides of the heat management device, in which volumes the heat management components can be arranged. This ensures maximum freedom in the arrangement and fitting of the heat management components.

[0020] A plate-shaped embodiment of the base element with integrated hollow volumes as fluid paths within the base element enables the necessary fluid paths for connecting all the heat management components of the cooling/heating circuit which are to be fitted to be accommodated in one component in a manner which is as space-saving as possible.

[0021] The heat management system preferably further comprises a second heat management component, which is arranged at a second location on the one of the first side and the second side. The hollow volume preferably also extends to the second location and the additional heat management component is used to measure a parameter of a fluid flowing in the hollow volume between the first location and the second location.

[0022] If the additional heat management component is used to measure a parameter of the fluid that flows between the first heat management component and the second heat management component, the space-saving arrangement of the first heat management component, the second heat management component and the additional heat management component on one side of the heat management device is made even more difficult. In order to reduce flow and heat losses, it is desirable to arrange the first heat management component and the second heat management component as close to one another as possible and thus to be able to design the hollow volume to have the smallest possible extent. The first heat management component and the second heat management component too cannot be arranged arbitrarily close to one another owing to their respective spatial extent. The additional heat management component must be arranged in such a way that it is situated on the fluid path between the first heat management component and the second heat management component. The additional heat management component must therefore also be arranged as close as possible to the first heat management component and the second heat management component, for example between the first heat management component and the second heat management component. If the additional heat management component is arranged opposite the first heat management component and the second heat management component, the first heat management component, the second heat management component and the additional heat management component can thus be arranged closer to one another. This results in an optimization of the installation space, and the fluid path, that is to say the hollow volume between the first heat management component, the additional heat management component and the second heat management component, can be designed to have a smaller extent.

[0023] The base element preferably comprises at least one first fluidic connection arranged at the first location on one of the first side and the second side, one second fluidic connection arranged at the second location on the one of the first side and the second side, and one additional fluidic connection arranged at the additional location on the other of the first side and the second side. At least one of the first fluidic connection, the second fluidic connection, and the additional fluidic connection is fluidically connected to the first hollow volume. Furthermore, the first heat management component is preferably fluidically connected to the first fluidic connection, and/or the second heat management component is fluidically connected to the second fluidic connection, and/or the additional heat management component is fluidically connected to the additional fluidic connection.

[0024] Some heat management components must be positioned in the fluid path, i.e. fluidically connected to the hollow volume, in order to be able to fulfil their function. For example, a pump must be positioned in the fluid path, i.e. in this case the fluid located in the hollow volume must flow through it to enable the fluid to be pumped. Valves must also be positioned in the fluid path to enable open-loop and closed-loop control of the flow of the fluid in the fluid path. Moreover, some temperature sensors as well as pressure sensors require direct contact with the fluid in order to be able to correctly detect the temperature or pressure of the fluid. Further heat management components such as compressors or certain designs of heat exchangers likewise require positioning in the fluid path. The possibility of positioning heat management components at the at least one fluidic connection in the fluid path thus enables optimum functioning of these heat management components.

[0025] There are further heat management components which do not require direct positioning in the fluid path, i.e. direct contact with or through-flow of the fluid to fulfil their function. For these heat management components, it may be sufficient to be able to exchange thermal energy with the fluid in the hollow volume in order to fulfil their function in a cooling/heating circuit or heat management system. Certain types of temperature sensors as well as heat exchangers do not require direct contact with the fluid but also function if the exchange of thermal energy with the fluid is ensured. Fitting heat management components at a location that does not have a fluidic connection and that allows the heat management components to be fitted to the heat management device without direct contact with the fluid in the fluid path enables these heat management components too to fulfil their function. For this purpose, the locations should be embodied in such a way that the necessary exchange of thermal energy between the heat management component to be fitted and the fluid flowing in the fluid path is ensured.

[0026] As fluidic connections for connecting the heat management components to the heat management device, it may be possible to use standardized standard components, which are fitted to the base element. This ensures that a large selection of heat management components with standard-compliant connection elements can be fitted to the connections of the heat management device. The connections can also be formed integrally with the base element and can be produced with the base element in one production process, such as, for example, 3D printing or a casting processes. It is thereby possible to achieve a reduction in production costs and time.

[0027] The base element preferably comprises aluminium or an aluminium alloy. In particular, the base element is made of aluminium or an aluminium alloy.

[0028] As a further preference, the base element comprises polymer. In particular, the base element is composed of a polymer as for example a plastic.

[0029] Heat management systems such as cooling/heating circuits serve different functions and accordingly have to meet different requirements. For example, there are great differences in the type of components to be cooled/heated and in the amounts of thermal energy to be transported. Accordingly, different fluids are selected which circulate in the cooling/heating circuits, and the pressures prevailing in the cooling/heating circuits can also vary greatly. In order to meet different requirements, for example pressures to be withstood or chemical resistance to certain fluids, it may be necessary or advantageous to produce the heat management device from a suitable material. The heat management device can, for example, be produced from aluminium in order to be able to achieve higher pressures of the fluid, for example for a cooling/heating circuit for drive components with high demands on the amounts of thermal energy to be transported. Alternatively, the heat management device can be produced from a polymer material as plastic in order to achieve low-cost production while simultaneously fulfilling the lower pressure requirements of a cooling/heating circuit for interior air conditioning.

[0030] The present document furthermore describes a method for producing a heat management device for forming the heat management system. The method comprises the steps of providing a first base element having at least one hollow volume, producing a first fluidic connection on one of a first side and a second side of the base element, and producing an additional fluidic connection on the other of the first side and the second side. The method furthermore comprises the steps of fitting the first heat management component to the first fluidic connection, and fitting the additional heat management component to the additional fluidic connection.

Description of the figures

[0031] Fig. 1 shows a first perspective view of a heat management device.

[0032] Fig. 2 shows a second perspective view of the heat management device.

[0033] Fig. 3 shows a first perspective view of a heat management system.

[0034] Fig. 4 shows a second perspective view of the heat management system.

[0035] Fig. 5 shows a flow chart of a method for producing the heat management device for forming the heat management system.

Detailed description of the invention

[0036] The invention will now be described on the basis of the drawings. It is assumed that the embodiments and aspects of the invention which are described here are only examples and in no way limit the scope of protection of the claims. The invention is defined by the claims and their equivalents. It is assumed that features of one aspect or one embodiment of the invention can be combined with a feature of another aspect or other aspects and/or embodiments of the invention. [0037] Fig. 1 shows a first perspective view of a heat management device 10. The heat management device 10 comprises a base element 30. The base element 30 is designed as an approximately cuboidal and plate-shaped component. The base element 30 extends in the direction of a plane E. The extent of the base element 30 in a direction perpendicular to the plane E is significantly smaller than the extent of the base element 30 in the plane E. The base element 30 can also have a shape other than the cuboidal shape, for example a disc shape.

[0038] Alternatively, the base element 30 can also have only the contours of a cuboid or of some other shape, wherein the base element 30 can have apertures in some parts. Alternatively, the base element 30 can also have contours other than the contours of a geometric shape, that is to say can be embodied as a free form. This can be advantageous, particularly in order to save material and thus costs and weight.

[0039] The base element 30 has two surfaces, which are oriented parallel to the plane E. One of these two surfaces is situated on a first side 40 of the base element 30, the other of the two surfaces is situated on a second side 45 of the base element 30. The first side 40 is situated on the opposite side of the base element 30 from the second side 45.

[0040] The heat management device 10 comprises a hollow volume 80 (see Fig. 2). The hollow volume 80 is embodied in the form of an elongate hollow volume within the base element 30. The hollow volume 80 has a circular cross section and has an elongate extent in the plane E. The hollow volume 80 can also have some other cross section and the cross section of the hollow volume 80 can change along the extent in the plane E.

[0041] The hollow volume 80 extends in the plane E in a convoluted manner. The hollow volume 80 can have a very limited, even approximately punctiform extent in the plane E or can extend in an elongate or sheet-like form over a large part of the base element 30 in the plane E.

[0042] The hollow volume 80 is suitable for receiving a medium, such as, for example, a fluid as gas or a liquid F. The hollow volume 80 thus forms a fluid path or conduit for receiving the fluid F. The fluid F can flow in the hollow volume 80. [0043] The fluid F is, for example, a refrigerant which is suitable for use in a cooling/heating circuit and can absorb thermal energy at low temperature and low pressure and can release thermal energy at higher temperature and higher pressure. The fluid F is, for example, ammonia, hydrocarbons, carbon dioxide or a synthetic refrigerant. The fluid F can also be some other medium which can absorb and release thermal energy. The fluid F can be, for example, a coolant which is suitable for use in a cooling circuit and is suitable for the removal of thermal energy. The fluid F can be, for example, water or oil or a dielectric fluid.

[0044] In addition to the hollow volume 80, the heat management device 10 can comprise further hollow volumes, which can be separate from one another or connected to one another.

[0045] The heat management device 10 further comprises a first fluidic connection 60, which is arranged at a first location on the first side 40 of the first base element 30. The first fluidic connection 60 enables a heat management component 110, such as a valve, a pump, a compressor, or a heat exchanger, to be fitted to or mounted on the fluidic first connection 60.

[0046] The first fluidic connection 60 represents an access to the hollow volume 80, thus enabling a heat management component 110 fitted to the first fluidic connection 60 to be positioned in the fluid path defined by the hollow volume 80. The heat management component 110 can therefore be fluidically connected to the hollow volume 80 by means of the first fluidic connection 60, thus enabling the fluid F carried in the hollow volume 80 to reach or enter the heat management component 110. For example, a valve can be fitted to the first fluidic connection 60 in order to influence the flow of the fluid F in the hollow volume 80. Also, for example, a heat exchanger could be connected to the hollow volume 80 by means of the first fluidic connection 60, thus enabling the fluid F to flow through the heat exchanger.

[0047] The first fluidic connection 60 comprises a sealing element to prevent leakage of the fluid F between the base element 30 and the heat management component 110 to be fitted. The sealing element on the first fluidic connection 60 can also be omitted. Alternatively, the heat management component 110 too can comprise a sealing element to seal the heat management component 110 with respect to the base element 30. [0048] In addition to the fluidic connection of the heat management component 110 to the hollow volume 80, the first fluidic connection 60 also enables the mechanical fastening of the heat management component 110 to the first fluidic connection 60 and thus to the base element 30. The heat management component 110 can be fastened to the first fluidic connection 60 by a fastening means such as a screw or by a plug connection, for example.

[0049] Alternatively, the first fluidic connection 60 at the first location 122 can be omitted. In this case, a heat management component 110 to be fitted at the first location 122 can be connected in a thermally conductive manner to the fluid F, but cannot be positioned in the fluid path defined by the hollow volume 80. In this case, there is no fluidic link between the heat management component 110 fitted at the first location 122 and the hollow volume 80. The heat management component 110 thus does not come into direct contact with the fluid F in the hollow volume 80, but can exchange thermal energy with the fluid F. In addition, the possibility of a mechanical fastening of the heat management component 110 to the base element 30 can be provided at the first location 122, for example by means of a fastening element such as a screw or by means of a plug connection.

[0050] The heat management device 10 further comprises a second fluidic connection 65, which is arranged at a second location 126 on the first side 40 of the base element 30. The second fluidic connection 65 enables a further heat management component 110, such as a valve, a pump, a compressor, or a heat exchanger, to be fitted to or mounted on the second fluidic connection 65. As already described for the first fluidic connection 60, the second fluidic connection 65 allows the positioning of the heat management component 110 to be fitted in the fluid path which is formed by the hollow volume 80. Alternatively, the second location 126 can be embodied, in a manner analogous to the statements relating to the first location 122, in such a way that the heat management component 110 to be fitted is connected in a thermally conductive manner to the fluid F but is not positioned in the fluid path defined by the hollow volume 80.

[0051] Fig. 2 shows a second perspective view of the heat management device 10. The heat management device 10 further comprises an additional fluidic connection 68, which is arranged at an additional location 124 on the second side 45 of the base element 30. The additional fluidic connection 68 enables a further heat management component 110, such as a temperature sensor, a flow sensor or a pressure sensor, to be fitted to or mounted on the second additional connection 68. As already described for the first fluidic connection 60 and the second fluidic connection 65, the additional fluidic connection 68 allows the positioning of the heat management component 110 to be fitted in the fluid path which is formed by the hollow volume 80. Alternatively, the additional location 124 can be embodied, in a manner analogous to the statements relating to the first location 122 and the second location 126, in such a way that the heat management component 110 to be fitted is connected in a thermally conductive manner to the fluid F but is not positioned in the fluid path defined by the hollow volume 80.

[0052] The hollow volume 80 extends between the first location 122, the second location 126 and the additional location 124. The first fluidic connection 60, the second fluidic connection 65 and the third fluidic connection 68 are connected by the hollow volume 80. Thus, the fluid F can flow between the first fluidic connection 60, the second fluidic connection 65, and the additional fluidic connection 68. Similarly, the fluid F can thus flow between a heat management component 110 fitted to the first fluidic connection 60, a heat management component 110 fitted to the second fluidic connection 65, and a heat management component 110 fitted to the additional fluidic connection 68. By exchanging thermal energy between the heat management components 110 and the fluid F, thermal energy can thus be exchanged between the heat management components 110 fitted to the first fluidic connection 60, the second fluidic connection 65 and the additional fluidic connection 68.

[0053] The heat management device 10 can have further fluidic connections, which can be arranged at different locations on the first side 40 and/or the second side 45 and are embodied in a manner analogous to the statements relating to the first fluidic connection 60, the second fluidic connection 65 and the additional fluidic connection 68. The heat management device 10 can also have further connections, which are arranged on one of the narrow surfaces of the base element 30. The heat management device 10 can also have further locations that are suitable for fitting further heat management components 110 without positioning the heat management component 110 in a fluid path.

[0054] The heat management device 10 represents a fluidic link between the heat management components 110 fitted to the fluidic connections 60, 65, 68. Depending on how many fluidic connections and hollow volumes are arranged in and on the heat management device 10 and how these are arranged relative to one another, a multiplicity of heat management components 110 can be fluidically connected to one another. In particular, a circuit can be formed in which the heat management components 110 fitted to the heat management device 10 are fluidically connected to one another.

[0055] The base element 30 is produced in a casting process. The hollow volume 80 and the fluidic connections 60, 65, 68 are provided by corresponding cores in the casting process. The dimensions of the base element 30 in a direction perpendicular to the plane E are greater in regions in which the hollow volume 80 is situated than in regions in which no hollow volume is situated. The hollow volume 80 and/or the fluidic connections 60, 65, 68 can also be introduced completely or in parts after the casting process, for example by means of machining production processes. The base element 30 can also be designed as a solid component into which the hollow volume 80 and the fluidic connections 60, 65, 68 are introduced by a suitable production method (for example a machining production method). Alternatively, the base element 30 can be produced by generative production methods such as 3D printing.

[0056] The base element 30 is produced from aluminium. When selecting the material, particular account must be taken of the pressures to be expected in the hollow volume 80 and the chemical resistance to the fluid F. Aluminium construction allows a weight-saving embodiment of the base element 30 which can withstand the expected pressures in the hollow volume 80 without damage. The base element 30 can also be produced from some other material, such as, for example, some other metal, fibre-reinforced plastic or some other polymer material.

[0057] Fig. 3 shows a first perspective view of the heat management system 140. The heat management system 140 can be installed in a vehicle 100, in particular in an electric or hybrid vehicle, but can also be used in other vehicles or systems. The heat management system 140 comprises the heat management device 10. The heat management system 140 can also comprise a further heat management device 10 if required, for example if more than one heating/cooling circuit is to be implemented.

[0058] The heat management system 140 also comprises a first heat management component 120, which is fitted to the first fluidic connection 60. The first heat management component 120 is a valve, such as a shut-off valve (SOV) for influencing the flow of the fluid F in the hollow volume 80. The heat management system 140 further comprises a second heat management component 125, which is fitted to the second fluidic connection 65. The second heat management component 125 is a further valve, such as a shut-off valve (SOV) for influencing the flow of the fluid F in the hollow volume 80.

[0059] Fig. 4 shows a second perspective view of the heat management system 140. The heat management system 140 further comprises an additional heat management component 128, which is fitted to the additional fluidic connection 68. The additional heat management component 128 is a temperature sensor, such as a pressure-temperature sensor (PT sensor) for detecting the temperature of the fluid F.

[0060] The temperature of the fluid F detected by the additional heat management component 128 is used as an input variable for controlling the first heat management component 120 and the second heat management component 125.

[0061] The first heat management component 120 and the second heat management component 125 are both arranged on the first side 40 and are close together. Arranging the additional heat management component 128 on the second side 45 enables the additional heat management component 128 to be positioned in the fluid path between the first heat management component 120 and the second heat management component 125. At the same time, the fluid path between the heat management components 120, 125, 128 can be kept as short as possible.

[0062] Fig. 5 shows a flow chart of a method for producing the heat management device 10 for forming the heat management system 140. In step S200, the base element 30 is provided, which comprises at least the hollow volume 80. As described above, the base element 30 with the hollow volume 80 can be produced by means of different production methods.

[0063] In step S220, the first fluidic connection 60 is produced on the one of the first side 40 and the second side 45 of the base element 30. In step S240, the additional fluidic connection 68 is produced on the other of the first side 40 and the second side 45 of the base element 30. As described above, the fluidic connections 60, 68 can be produced on the base element 30 by means of different production methods.

[0064] In step S260, the first heat management component 120 is fitted to the first fluidic connection 60. In step S280, the additional heat management component 128 is fitted to the additional fluidic connection 68.

[0065] Fitting S260, S280 of the heat management components 120, 128 to the fluidic connections 60, 68 can comprise different steps depending on the configuration of the fluidic connections 60, 68 and of the heat management components 120, 128. For example, a male connection part of the heat management components 120, 128 can be inserted into a female receiving part of the fluidic connections 60, 68. In addition, a further step for mechanically fixing the heat management components 120, 128 on the fluidic connections 60, 68, such as, for example, fastening the heat management components 120, 128 on the fluidic connections 60, 68 by means of a fastening element, such as a screw, can be included in method steps S260 and S280.

List of reference signs

10 heat management device

30 base element

40 first side

45 second side

60 first fluidic connection

65 second fluidic connection

68 additional fluidic connection

80 hollow volume

100 vehicle

110 heat management component

120 first heat management component

122 first location

124 additional location

125 second heat management component

126 second location

128 additional heat management component

140 heat management system

E plane

F fluid

S200 providing a first base element

S220 producing a first fluidic connection

S240 producing an additional fluidic connection

S260 fitting the first heat management component

S280 fitting the additional heat management component