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Patent Searching and Data


Title:
HEAT MEDIUM HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/077266
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a heat medium heating device which is capable of improving adhesion between a PTC element and an electrode plate, and furthermore adhesion between a PTC heater and a heat medium channel-forming member, while suppressing increase in the cost. A heat medium heating device (10) is provided with: an inner pipe main body (21), on the inside of which a channel for a heat medium is formed; an outer pipe main body (31), which is arranged on the outer circumferential side of the inner pipe main body (21), and on the outside of which a channel for the heat medium is formed; and a PTC heater (40) that is sandwiched and held between the inner pipe main body (21) and the outer pipe main body (31). The outer shapes of the inner pipe main body (21) and the outer pipe main body (31) may be circular or may be rectangular. In addition, it is preferable that the inner pipe main body (21) and the outer pipe main body (31) are respectively provided with fins (24, 34) that face the channels of the heat medium.

Inventors:
WATANABE YASUNORI (JP)
CHUMAN YASUHARU (JP)
KUGA KAZUNORI (JP)
KOMINAMI SATOSI (JP)
Application Number:
PCT/JP2011/005341
Publication Date:
June 14, 2012
Filing Date:
September 22, 2011
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
WATANABE YASUNORI (JP)
CHUMAN YASUHARU (JP)
KUGA KAZUNORI (JP)
KOMINAMI SATOSI (JP)
International Classes:
B60H1/22; H01C7/02
Foreign References:
JPH0579695A1993-03-30
JPS5692343A1981-07-27
JPH0375431A1991-03-29
JPH0869856A1996-03-12
JPH05258841A1993-10-08
JP2008109137A2008-05-08
Other References:
See also references of EP 2650154A4
Attorney, Agent or Firm:
OBA, Mitsuru et al. (JP)
Mitsuru Oba (JP)
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Claims: