Title:
HEAT MEDIUM HEATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/181722
Kind Code:
A1
Abstract:
In this heat medium heating device, cost reduction is facilitated by simplifying the internal electrical connection and by reducing the number of components. The heat medium heating device is provided with a housing which has a heater supported thereinside and has, near the heater, a flow channel through which a heat medium flows, and the housing also has thereinside a control chamber in which a control board for controlling the heater is disposed. The housing is provided with a support protrusion for supporting the control board at a position away from the heater, and with a raised part that comes into thermal-contact with the flow channel of the heat medium and that has a placement surface, which is positioned near the control board and is raised in the protruding direction of the support protrusion. On the placement surface, heat generative circuit components to be connected to the control board are placed.
Inventors:
YASUMOTO KENJI (JP)
Application Number:
PCT/JP2023/005388
Publication Date:
September 28, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
SANDEN CORP (JP)
International Classes:
H05B3/06
Foreign References:
| JP2016159693A | 2016-09-05 | |||
| JP2013220708A | 2013-10-28 | |||
| CN111954323A | 2020-11-17 | |||
| JP2020525986A | 2020-08-27 | |||
| JP2011225074A | 2011-11-10 |
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