Title:
HEAT MEDIUM SUBSTRATE, AND HEAT TRANSPORT SYSTEM AND HEAT PUMP SYSTEM USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/163764
Kind Code:
A1
Abstract:
This heat medium substrate includes a hydrophilic ionic liquid and water. The hydrophilic ionic liquid has a coefficient of viscosity at 25°C of 30 mPa∙s or less. As the ionic liquid has good heat stability, heat stability of the heat medium substrate can be ensured. In addition, by providing the hydrophilic ionic liquid with a coefficient of viscosity at 25°C of 30 mPa∙s or less, the heat medium substrate can have a reduced coefficient of kinematic viscosity. Furthermore, by dissolving the ionic liquid in water, a freezing point depression effect can be achieved, and a low freezing point can thereby be achieved.
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Inventors:
NARUSE JUNICHI (JP)
KAWAGUCHI TOURU (JP)
INAGAKI KOUJI (JP)
KANEKO TAKASHI (JP)
KAWAGUCHI TOURU (JP)
INAGAKI KOUJI (JP)
KANEKO TAKASHI (JP)
Application Number:
PCT/JP2018/005621
Publication Date:
September 13, 2018
Filing Date:
February 19, 2018
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
C09K5/10; F25B1/00
Domestic Patent References:
| WO2013050230A1 | 2013-04-11 |
Foreign References:
| JP2010235889A | 2010-10-21 | |||
| US20120157360A1 | 2012-06-21 | |||
| JP2013543965A | 2013-12-09 | |||
| JP2013529280A | 2013-07-18 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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